Patents by Inventor Mathias Weiss

Mathias Weiss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9564555
    Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: February 7, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Steffen Köhler, Moritz Engl, Frank Singer, Stefan Grötsch, Thomas Zeiler, Mathias Weiss
  • Publication number: 20150325869
    Abstract: A humidifier is provided with a housing and at least one water-permeable membrane arranged in the housing and provided with first and second opposed sides. A first gas stream having a first moisture contents is guided on the first opposed side and a second gas stream having a second moisture contents is guided on the second opposed side through the humidifier. The first moisture contents is higher than the second moisture contents. The at least one water-permeable membrane is folded and has folds.
    Type: Application
    Filed: May 1, 2015
    Publication date: November 12, 2015
    Inventors: Michael Fasold, Ralf Werner, Egon Ellmer, Mathias Weiss, Michael Maier, Patricie Merkert, Dirk Eberspaecher, Peter Muench, Andreas Kloz, Thomas Tschech, Oliver Wiesner, Andreas Epp, Reiner Bulling, Volker Kuemmerling, Marcel Mayer
  • Publication number: 20120167968
    Abstract: A method is described for manufacturing solar cells having a selective emitter. Wafers free of saw damage are initially provided. A doping source is then applied over the entire surface of the wafer and the dopant is initially lightly diffused into the wafer until a first layer resistance area is obtained. The applied doping source is subsequently structured, only those areas which essentially correspond to the sections on the wafer to be subsequently contacted remaining as a result of the structuring.
    Type: Application
    Filed: March 26, 2010
    Publication date: July 5, 2012
    Inventors: Jan Lossen, Mathias Weiss, Karsten Meyer, Tobias Wuetherich
  • Publication number: 20100230697
    Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
    Type: Application
    Filed: August 11, 2008
    Publication date: September 16, 2010
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Steffen Köhler, Moritz Engl, Frank Singer, Stefan Grötsch, Thomas Zeiler, Mathias Weiss
  • Publication number: 20030096171
    Abstract: A low volume nonwoven separator and an electrochemical cell employing the separator are provided. The cell includes a positive electrode and a negative electrode. The nonwoven separator is disposed between the positive electrode and negative electrode. The nonwoven separator comprises, prior to insertion in the cell, a non-compressed single layer dry thickness in the range of 0.04 to 0.09 mm, and an average pore size of no greater than 14 &mgr;m. The cell further includes an electrolyte in contact with the separator and the positive and negative electrodes.
    Type: Application
    Filed: November 8, 2002
    Publication date: May 22, 2003
    Inventors: Gary Lee Thrasher, Jean-Francois Audebert, Hans-Joachim Feistner, Mathias Weiss, Gunter Frey, Raoul Farer
  • Patent number: 5865051
    Abstract: Procedure and apparatus for the optimized manufacture of coil springs on automatic spring winding machines. It is the object of the present invention to offer both a procedure and an apparatus by which even in case of fluctuating values of the wire parameters high accuracies during the spring manufacture are guaranteed and simultaneously the scrap is minimized. The solution to this problem is that prior to the winding the wire parameters are determined and the measuring results are used directly for the adjustment of the position of the winding pins or winding rollers and/or the pitch wedge, and that the wire between the uncoiling device and the guiding assembly forms a loop whereby the lateral deflection of this wire loop is measured by a recognition unit and the uncoiling device carries out an additional movement controlled by the recognition unit.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: February 2, 1999
    Assignee: Wafios Maschinenfabrik GmbH & Co. Kommanditgesellschaft
    Inventors: Uwe Otzen, Hans-Jurgen Schorcht, Mathias Weiss