Patents by Inventor Mathieu Laliberté

Mathieu Laliberté has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package using a substrate side coaxial interface
    Patent number: 10020249
    Abstract: An electronic device is provided. In particular, the electronic device includes (i) an electronic integrated circuit (IC) chip, (ii) a chip mounting substrate for mounting the electronic IC chip on a chip side of the chip mounting substrate, (iii) a radio frequency (RF) interface component disposed on an opposing side of the chip mounting substrate, the opposing side opposing the chip side, and (iv) an RF bridge component penetrating a first opening in the chip mounting substrate and configured to operably connect the electronic IC chip and the RF interface component.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: July 10, 2018
    Assignee: Ciena Corporation
    Inventors: Jean-Frédéric Gagné, Mathieu Laliberté
  • ELECTRONIC DEVICE PACKAGE USING A SUBSTRATE SIDE COAXIAL INTERFACE
    Publication number: 20180114741
    Abstract: An electronic device is provided. In particular, the electronic device includes (i) an electronic integrated circuit (IC) chip, (ii) a chip mounting substrate for mounting the electronic IC chip on a chip side of the chip mounting substrate, (iii) a radio frequency (RF) interface component disposed on an opposing side of the chip mounting substrate, the opposing side opposing the chip side, and (iv) an RF bridge component penetrating a first opening in the chip mounting substrate and configured to operably connect the electronic IC chip and the RF interface component.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 26, 2018
    Applicant: Ciena Corporation
    Inventors: Jean-Frédéric Gagné, Mathieu Laliberté