Abstract: The invention concerns a method of optical, inspection of an electronic circuit (Card) including the acquisition of images of the electronic circuit by image sensors (C), the use of the images to determine the offset between the position of the electronic circuit (Card) and an inspection position, and the use of said images in at least another step of the method.

Abstract: The invention concerns a method of optical, inspection of an electronic circuit (Card) including the acquisition of images of the electronic circuit by image sensors (C), the use of the images to determine the offset between the position of the electronic circuit (Card) and an inspection position, and the use of said images in at least another step of the method.

Abstract: Correction of an initial three-dimensional image of a deformed object comprises the provision of a model of the undeformed object comprising first zones, the determination in the initial three-dimensional image of second zones corresponding to the first zones, the determination of a first geometric transformation which maps the second zones to the first zones and the determination of a three-dimensional image corrected on the basis of the first geometric transformation and of the initial three-dimensional image.

Abstract: Correction of an initial three-dimensional image of a deformed object comprises the provision of a model of the undeformed object comprising first zones, the determination in the initial three-dimensional image of second zones corresponding to the first zones, the determination of a first geometric transformation which maps the second zones to the first zones and the determination of a three-dimensional image corrected on the basis of the first geometric transformation and of the initial three-dimensional image.

Abstract: A three-dimensional image acquisition system including: at least two projectors aligned in a direction and suitable for illuminating a scene, the projection axes of the projectors defining a plane for each projector, and being turned toward the scene. A first and second camera are placed on one side of said plane, and a third and fourth camera placed on the other side of said plane. The optical axis of the first and second cameras form, with said plane, a different first and second angle, respectively, and the optical axis of the third and fourth cameras form, with said plane, a different third and fourth angle, respectively.

Abstract: A method for determining three-dimensional images of an object (Card) comprises projecting a display onto the object by means of a projector (P). A plurality of two-dimensional images of the object are acquired by at least one first image sensor (C), a relative movement of the object in relation to the assembly comprising the projector and the image sensor being carried out during the acquisitions of the images. A determination is made of the height of each point of the object as corresponding to an extremum of a function obtained from the acquired two-dimensional images.

Abstract: An installation of optical inspection of integrated circuits or the like includes a photographic system placed above a scene in a plane defined by a first and a second direction, the photographic system having several digital cameras each having an orthogonal array of pixels, all cameras having their respective optical axes inclined by a first angle with respect to a third direction perpendicular to the two others; and two projectors of determined patterns, these patterns being such that two straight lines projected by each of the projectors are aligned in the plane defined by the first two directions and are coplanar with a straight line interconnecting the optical centers of the two projectors.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a planar conveyor along a first direction of the objects to be analyzed and a photographic system placed above an area of the conveyor and in a fixed position with respect thereto, the photographic system comprising at least one first set of digital cameras each comprising an orthogonal array of pixels, said cameras being aligned in a second direction different from the first one, the cameras being all oriented so that one of the orthogonal directions of their pixel array forms a first angle with the first direction.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a planar conveyor along a first direction of the objects to be analyzed and a photographic system placed above an area of the conveyor and in a fixed position with respect thereto, the photographic system comprising at least one first set of digital cameras each comprising an orthogonal array of pixels, said cameras being aligned in a second direction different from the first one, the cameras being all oriented so that one of the orthogonal directions of their pixel array forms a first angle with the first direction.

Abstract: An installation of optical inspection of integrated circuits or the like, comprising: a photographic system placed above a scene in a plane defined by a first and a second direction, the photographic system comprising several digital cameras each comprising an orthogonal array of pixels, all cameras having their respective optical axes inclined by a first angle with respect to a third direction perpendicular to the two others; and two projectors of determined patterns, these patterns being such that two straight lines projected by each of the projectors are aligned in the plane defined by the first two directions and are coplanar with a straight line interconnecting the optical centers of the two projectors.