Patents by Inventor Mathilde Escudie

Mathilde Escudie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10543372
    Abstract: The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 28, 2020
    Assignees: The University of Melbourne, National ICT Australia Limtied
    Inventors: Steven Prawer, Kumaravelu Ganesan, David Garrett, Nicholas Apollo, Alastair Stacey, Mathilde Escudie, Hamish Meffin, Samantha Lichter
  • Publication number: 20170312528
    Abstract: The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively.
    Type: Application
    Filed: October 28, 2015
    Publication date: November 2, 2017
    Inventors: Steven Prawer, Kumaravelu Ganesan, David Garrett, Nicholas Apollo, Alastair Stacey, Mathilde Escudie, Hamish Meffin, Samantha Lichter