Abstract: An assembly includes a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, wherein the semiconductor component comprises a recess, wherein the temperature sensor unit comprises a housing element and a temperature sensor element, wherein the housing element comprises a first housing section and a second housing section, wherein the second housing section protrudes from the first housing section, wherein the temperature sensor element is at least partially located in the second housing section, the second housing section projecting from the first housing section, the temperature sensor element being arranged at least partially in the second housing section, the second housing section being arranged in the recess of the semiconductor component, and a switch arrangement having at least one such assembly and at least one further semiconductor component.

Abstract: A half-bridge switch arrangement includes a high-side switch having a plurality of parallel-connected first semiconductor switching elements, a low-side switch having a plurality of parallel-connected second semiconductor switching elements, a positive busbar connected to a first terminal of each of the first semiconductor switching elements, a negative busbar connected to a second terminal of each of the second semiconductor switching elements, and a heat sink arranged between a first section of the positive busbar and a first section of the negative busbar, wherein an outer surface of each of the first semiconductor switching elements is in thermal contact with a surface of the first section of the positive busbar facing away from the heat sink, and wherein an outer surface of each of the second semiconductor switching elements is in thermal contact with a surface of the first section of the negative busbar facing away from the heat sink.