Abstract: A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

Abstract: A system for ejecting droplets of a fluid is described. The system includes a substrate having a flow path body that includes a fluid pumping chamber, a descender fluidically connected to the fluid pumping chamber, and a nozzle fluidically connected to the descender. The nozzle is arranged to eject droplets of fluid through an outlet formed in an outer substrate surface. The flow path body also includes a recirculation passage fluidically connected to the descender. The system for ejecting droplets of a fluid also includes a fluid supply tank fluidically connected to the fluid pumping chamber, a fluid return tank fluidically connected to the recirculation passage, and a pump fluidically connecting the fluid return tank and the fluid supply tank. In some implementations, a flow of fluid through the flow path body is at a flow rate sufficient to force air bubbles or contaminants through the flow path body.

Abstract: A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.

Abstract: A fluid droplet ejection apparatus includes a substrate having a fluid inlet passage, a plurality of nozzles, and a plurality of flow paths each fluidically connecting the fluid inlet passage to an associated nozzle of the plurality of nozzles. Each flow path includes a pumping chamber connected to the associated nozzle and an ascender fluidically connected between the fluid inlet passage and the pumping chamber. The ascender is located proximate to an outside edge of the fluid inlet passage.

Abstract: Systems and apparatus for ejecting fluid. A fluid injection apparatus includes a fluid ejector unit for ejecting a droplet of fluid, an integrated circuit, and a conductive trace electrically coupling the fluid ejector unit and the integrated circuit. A portion of the conductive trace includes a fuse.

Abstract: The present invention relates to methods for determining the uniformity of the piezoelectric effect throughout a piezoelectric material using the time-of-flight of an acoustic wave through the material as a gauge of that uniformity.

Abstract: The present invention comprises an inkjet print head structure wherein the placement of the transducer electrodes in combination with the particular poling direction of the print head transducer material provides for an efficient combination of shear and normal mode actuation of the print head. The preferred print head structure may be formed as a densely packed linear series of substantially parallel ink channels interspaced between and adjacent to a series of substantially parallel air channels. Further, the present invention provides for a print head structure wherein structures in contact with ink are maintained at ground potential. The present invention provides for a method to manufacture a print head having an array of densely packed ink channels having the characteristics of reduced mechanical crosstalk.