Abstract: A fingerprint sensor module for a smartcard, the fingerprint sensor module comprising: a first substrate; a fingerprint sensing device mounted on a first side of the first substrate, the fingerprint sensing device having a sensing surface facing in a first direction of the fingerprint sensor module; a second substrate arranged on a second side of the first substrate, opposite the first side, the second substrate comprising a contact area having a plurality of terminal contact pads configured to connect the fingerprint sensor module to an external terminal, the terminal contact pads facing a second direction of the fingerprint sensor module, opposite the first direction; and wherein the contact area comprises at least one finger contact pad configured to provide a potential to a finger in contact with the finger contact pad during fingerprint image capture.

Abstract: A smartcard comprising: a plurality of smartcard substrate layers; an antenna layer comprising an antenna; a fingerprint sensor module embedded in the smartcard and connected to the antenna layer, the fingerprint sensor module being configured to receive energy and communicate with a reading device via the antenna, and wherein the fingerprint sensor module is galvanically isolated from an outside of the smartcard.

Abstract: Method for manufacturing a biometric imaging module, the method comprising: providing a carrier tape; forming a sensor opening and at least one contact pad opening in the carrier tape, wherein the sensor opening is adjacent to the contact pad opening; and from a top side of the carrier tape, arranging a biometric sensor on the carrier tape such that a body of the biometric sensor is arranged in the sensor opening and a conductive contact pad of the biometric sensor is aligned with and accessible through the contact pad opening from a backside of the carrier tape, and such that a sensing surface of the biometric sensor is facing in the same direction as the top side of the carrier tape.

Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

Abstract: In an aspect, a fingerprint sensing module configured to be integrated in a device for biometric authentication of a user of the device is provided. The fingerprint sensing module comprises a fingerprint sensor and a display configured to display information to the user; the display comprising pixel elements being arranged in the display such that the pixel elements do not obscure a sensing area of the fingerprint sensor in which area the fingerprint sensor is being configured to detect a finger of the user.

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.

Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

Abstract: It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.

Abstract: It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.

Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.

Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.