Patents by Inventor Matsuko Saito

Matsuko Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper electroplating solution and method of copper electroplating
    Patent number: 9637833
    Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: May 2, 2017
    Inventors: Matsuko Saito, Makoto Sakai, Shinjiro Hayashi
  • COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING
    Publication number: 20140174937
    Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.
    Type: Application
    Filed: December 24, 2012
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Matsuko Saito, Makoto Sakai, Shinjiro Hayashi