Patents by Inventor Matsuo Kishi

Matsuo Kishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200024710
    Abstract: An object of the present invention is to provide an electroformed part favorable for an assembly part of a timepiece or the like and a timepiece using the same. The present invention relates to an electroformed part, which is an electroformed part composed of a nickel-iron alloy constituted by nickel, iron, and unavoidable impurities, containing iron at 5 to 25% by mass, and having a roughly layered form portion in which a stacked form portion having an inclined iron content in a thickness direction is repeatedly stacked a plurality of times. It is preferred that the stacked portion is constituted by crystal grains having an average grain diameter of 50 nm or less.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 23, 2020
    Inventors: MATSUO KISHI, Miei Takahama
  • Patent number: 10504957
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in a vertical cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. A gap is formed between the semiconductor substrate and the portion of the magnetic body that is substantially parallel to the semiconductor substrate, and the gap lies above the entire top surfaces of the Hall elements. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 10, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • Patent number: 10429453
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 1, 2019
    Assignee: ABLIC INC.
    Inventors: Takaaki Hioka, Mika Ebihara, Hiroshi Takahashi, Matsuo Kishi, Miei Takahama
  • Patent number: 10290677
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 14, 2019
    Assignee: ABLIC Inc.
    Inventors: Matsuo Kishi, Miei Takahama (nee Sato), Hiroshi Takahashi, Mika Ebihara, Takaaki Hioka
  • Patent number: 10062836
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: August 28, 2018
    Assignee: ABLIC INC.
    Inventors: Takaaki Hioka, Mika Ebihara, Hiroshi Takahashi, Matsuo Kishi, Miei Takahama
  • Publication number: 20170271400
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA
  • Publication number: 20170269169
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Takaaki HIOKA, Mika EBIHARA, Hiroshi TAKAHASHI, Matsuo KISHI, Miei TAKAHAMA
  • Publication number: 20170271401
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical-cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 21, 2017
    Inventors: Matsuo KISHI, Miei TAKAHAMA (nee SATO), Hiroshi TAKAHASHI, Mika EBIHARA, Takaaki HIOKA
  • Publication number: 20170271575
    Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Takaaki HIOKA, Mika EBIHARA, Hiroshi TAKAHASHI, Matsuo KISHI, Miei TAKAHAMA
  • Patent number: 9310772
    Abstract: A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less. The metal structure preferably has one or more of a stress relaxation rate of 10% or less, a lattice constant of 3.535 ? to 3.56 ?, a yield stress of 1500 MPa or more, a Young's modulus of 150 GPa or more and a Vickers hardness of Hv 580 or more.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: April 12, 2016
    Assignee: SEIKO INSTRUMENTS INC.
    Inventors: Miei Konishi, Matsuo Kishi, Takashi Niwa
  • Patent number: 9045832
    Abstract: A timepiece part, such as a balance staff, an oscillating weight or a dial, is made of polycrystalline material having a plurality of crystals each having a size of 0.7 ?m or more and 3 mm or less. The crystals at a surface of the timepiece part have mirror-finished surfaces, and the surfaces may be anodized to provide corrosion resistance. The normal directions of the mirror-finished surfaces are different from one another and provide a metallic luster to the timepiece part.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: June 2, 2015
    Assignee: SEIKO INSTRUMENTS INC.
    Inventors: Takuya Murazumi, Akiko Araki, Takashi Niwa, Matsuo Kishi
  • Patent number: 8852491
    Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: October 7, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Takashi Niwa, Matsuo Kishi, Koichiro Jujo, Hiroyuki Hoshina
  • Publication number: 20140269228
    Abstract: A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: SEIKO INSTRUMENTS INC.
    Inventors: Miei KONISHI, Matsuo KISHI, Takashi NIWA
  • Patent number: 8801268
    Abstract: A detent escapement for a mechanical timepiece includes an escape wheel, a balance mounted for undergoing oscillation movement about a balance staff, a blade and an actuating spring. The balance has an unlocking stone and has an impulse jewel for contacting a wheel tooth of the escape wheel. The blade has a locking stone for contacting the wheel tooth of the escape wheel and is supported for undergoing movement in approaching and separating directions relative to the escape wheel. The actuating spring is configured to contact the unlocking stone and is mounted for undergoing elastic deformation along the approaching and separating directions with respect to the blade. An adjustment mechanism adjusts a projecting amount of a spring tip portion of the actuating spring from a blade tip portion of the blade.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: August 12, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Hiroki Uchiyama, Matsuo Kishi, Takashi Niwa, Masayuki Koda, Miei Sato
  • Patent number: 8747993
    Abstract: A sliding component has a multi-layer structure having a sliding portion configured to undergo sliding contact with a surface of another component different from the sliding component. A lubricating oil retaining/supplying structure retains a lubricating oil and supplies the lubricating oil to the sliding portion during sliding contact between the sliding portion and the surface of another component irrespective of a contact angle between the sliding portion and the surface of the another component.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: June 10, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Miei Sato, Natsuki Miyoshi, Matsuo Kishi, Naoki Amano, Takashi Niwa
  • Publication number: 20130252173
    Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.
    Type: Application
    Filed: May 20, 2013
    Publication date: September 26, 2013
    Applicant: SEIKO INSTRUMENTS INC.
    Inventors: Takashi NIWA, Matsuo KISHI, Koichiro JUJO, Hiroyuki HOSHINA
  • Patent number: 8518632
    Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: August 27, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Takashi Niwa, Matsuo Kishi, Koichiro Jujo, Hiroyuki Hoshina
  • Patent number: 8491183
    Abstract: A detent escapement for a timepiece capable of decreasing energy loss with respect to a free oscillation of a balance and improving a timekeeping accuracy is provided. In addition, a detent escapement of a timepiece capable of realizing miniaturization and suppressing variations in the accuracy of a finished product due to assembly errors is provided. A one-side actuating spring of a detent 7 is formed so that a maximum stress portion, which is generated at the time of operating due to the contact of an unlocking stone 4 when a balance 5 is return-rotated, is present to be perpendicular to a first straight line L1 which connects the center of the balance staff 9 and a fulcrum 23a of the blade 23, and to be the side opposite to the balance by a second straight line L2 which passes through the fulcrum 23a.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: July 23, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Masayuki Koda, Hiroki Uchiyama, Matsuo Kishi, Miei Sato, Takashi Niwa
  • Publication number: 20120325374
    Abstract: To provide a decorative component, a timepiece, and a manufacturing method of the timepiece capable of improving workability for color development and of enhancing decorativeness. A surface of an oscillating weight 160 develops a color by forming anode oxide films 22a and 22b on the surface of the oscillating weight body 164 which is formed using titanium or a titanium alloy, and on the surface of the oscillating weight body 164, of the portions at which the anode oxide films 22a and 22b are formed, a nitridization treatment layer 21 is formed at the portion at which the anode oxide film 22a is formed.
    Type: Application
    Filed: May 15, 2012
    Publication date: December 27, 2012
    Inventors: Takuya MURAZUMI, Akiko Araki, Takashi Niwa, Matsuo Kishi
  • Publication number: 20120155228
    Abstract: A manufacturing method of a timepiece part which has small variation in hardness and a metallic luster is provided. Configuration includes a heat treatment process that heat-treats a timepiece part and coarsens a plurality of crystals of titanium or the like, a shape processing process that processes the shape of the timepiece part, an etching process that etches titanium or the like, mirror-finishes the surfaces of each crystal, and makes the normal directions of the surfaces of each crystal to be different from one another, and an anodizing process that performs anodizing on the surface of the timepiece part.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 21, 2012
    Inventors: Takuya Murazumi, Akiko Araki, Takashi Niwa, Matsuo Kishi