Abstract: An object of the present invention is to provide an electroformed part favorable for an assembly part of a timepiece or the like and a timepiece using the same. The present invention relates to an electroformed part, which is an electroformed part composed of a nickel-iron alloy constituted by nickel, iron, and unavoidable impurities, containing iron at 5 to 25% by mass, and having a roughly layered form portion in which a stacked form portion having an inclined iron content in a thickness direction is repeatedly stacked a plurality of times. It is preferred that the stacked portion is constituted by crystal grains having an average grain diameter of 50 nm or less.

Abstract: An object of the present invention is to provide an electroformed part favorable for an assembly part of a timepiece or the like and a timepiece using the same. The present invention relates to an electroformed part, which is an electroformed part composed of a nickel-iron alloy constituted by nickel, iron, and unavoidable impurities, containing iron at 5 to 25% by mass, and having a roughly layered form portion in which a stacked form portion having an inclined iron content in a thickness direction is repeatedly stacked a plurality of times. It is preferred that the stacked portion is constituted by crystal grains having an average grain diameter of 50 nm or less.

Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in a vertical cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. A gap is formed between the semiconductor substrate and the portion of the magnetic body that is substantially parallel to the semiconductor substrate, and the gap lies above the entire top surfaces of the Hall elements. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.

Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.

Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.

Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.

Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.

Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical-cross section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a curve-shaped portion and a portion substantially parallel to the semiconductor substrate. The magnetic body has at least a part of a structure made of non-magnetic substance embedded therein.

Abstract: The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.

Abstract: A semiconductor device includes a semiconductor substrate having a plurality of Hall elements formed therein, and a magnetic body formed on the semiconductor substrate and having a magnetic flux converging function. The contour in vertical cross-section of the magnetic body on the semiconductor substrate has an outer circumferential portion. At least a part of the outer circumferential portion has a portion having an approximate quadrant shape, and a portion contiguous to the approximate quadrant portion and substantially parallel to the semiconductor substrate.

Abstract: A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less. The metal structure preferably has one or more of a stress relaxation rate of 10% or less, a lattice constant of 3.535 ? to 3.56 ?, a yield stress of 1500 MPa or more, a Young's modulus of 150 GPa or more and a Vickers hardness of Hv 580 or more.

Abstract: A timepiece part, such as a balance staff, an oscillating weight or a dial, is made of polycrystalline material having a plurality of crystals each having a size of 0.7 ?m or more and 3 mm or less. The crystals at a surface of the timepiece part have mirror-finished surfaces, and the surfaces may be anodized to provide corrosion resistance. The normal directions of the mirror-finished surfaces are different from one another and provide a metallic luster to the timepiece part.

Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Abstract: A metal structure includes, by mass %, Fe: 10% to 30%; S: 0.005% to 0.2%; and the balance consisting of Ni and unavoidable impurities, in which a maximum grain size of the metal structure is 500 nm or less.

Abstract: A detent escapement for a mechanical timepiece includes an escape wheel, a balance mounted for undergoing oscillation movement about a balance staff, a blade and an actuating spring. The balance has an unlocking stone and has an impulse jewel for contacting a wheel tooth of the escape wheel. The blade has a locking stone for contacting the wheel tooth of the escape wheel and is supported for undergoing movement in approaching and separating directions relative to the escape wheel. The actuating spring is configured to contact the unlocking stone and is mounted for undergoing elastic deformation along the approaching and separating directions with respect to the blade. An adjustment mechanism adjusts a projecting amount of a spring tip portion of the actuating spring from a blade tip portion of the blade.

Abstract: A sliding component has a multi-layer structure having a sliding portion configured to undergo sliding contact with a surface of another component different from the sliding component. A lubricating oil retaining/supplying structure retains a lubricating oil and supplies the lubricating oil to the sliding portion during sliding contact between the sliding portion and the surface of another component irrespective of a contact angle between the sliding portion and the surface of the another component.

Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Abstract: A detent escapement for a timepiece capable of decreasing energy loss with respect to a free oscillation of a balance and improving a timekeeping accuracy is provided. In addition, a detent escapement of a timepiece capable of realizing miniaturization and suppressing variations in the accuracy of a finished product due to assembly errors is provided. A one-side actuating spring of a detent 7 is formed so that a maximum stress portion, which is generated at the time of operating due to the contact of an unlocking stone 4 when a balance 5 is return-rotated, is present to be perpendicular to a first straight line L1 which connects the center of the balance staff 9 and a fulcrum 23a of the blade 23, and to be the side opposite to the balance by a second straight line L2 which passes through the fulcrum 23a.

Abstract: To provide a decorative component, a timepiece, and a manufacturing method of the timepiece capable of improving workability for color development and of enhancing decorativeness. A surface of an oscillating weight 160 develops a color by forming anode oxide films 22a and 22b on the surface of the oscillating weight body 164 which is formed using titanium or a titanium alloy, and on the surface of the oscillating weight body 164, of the portions at which the anode oxide films 22a and 22b are formed, a nitridization treatment layer 21 is formed at the portion at which the anode oxide film 22a is formed.