Patents by Inventor Matsuo Yamasaki

Matsuo Yamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate
    Patent number: 6495914
    Abstract: A metal base substrate for mounting a plurality of bare semiconductor chip devices thereon has first and second main surfaces. The first main surface has formed thereon at least one projection, and at least two recesses in which the bare semiconductor chip devices are to be mounted. The depth of these recesses is smaller than the length of said projection, and the recesses have a higher surface smoothness than said main surfaces of said metal substrate. The metal base substrate is partially chemically etched to form the projection, and the first main surface of the substrate is mechanically worked to form at least the recesses. The conductive projection is isolated from the portion on which the bare semiconductor chip devices are mounted, of the base substrate, and the conductive projection acts as a terminal that can be electrically connected to the outside on the first and second main surfaces of the base substrate.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: December 17, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kenji Sekine, Hiroji Yamada, Matsuo Yamasaki, Osamu Kagaya, Kiichi Yamashita