Abstract: An IC socket is provided in which an IC package is loaded on a socket base and a pressing cover is closed relative to the socket base to cause an IC pressing member mounted on the pressing cover to press leads on the IC package against contacts of the IC socket. The IC pressing member is provided with a plurality of unitary pressing pads, and the IC pressing member is shiftable to different pressing positions to utilize different unitary pressing pads.

Abstract: An IC socket has an IC accommodating portion, at least one ejection lever disposed in the IC accommodating portion, and a socket board for supporting a generally central portion of the lever in such a manner as to be able to effect a seesaw motion. An IC is supported by a push-up lever portion on one end of the lever for effecting the seesaw motion. A push-down force is exerted on the push-down lever portion on the other end for effecting a seesaw motion of the lever, thereby to move up the push-up lever portion on the one end in order to push up the IC. The IC socket is characterized in that the push-up lever portion is provided with a small projection on a lower surface of the push-up lever portion and a cone-shaped concave portion is formed at a position corresponding to the small production in the socket board so that the lever is correctly positioned with respect to the socket board.