Abstract: An article of manufacture includes a PV element having a conductive layer positioned on a light-incident side of the PV element, a conductor electrically coupled to the conductive layer, and a conductive particle matrix interposed between the conductor and the conductive layer at a number of positions on the conductive layer. The article further includes a carrier film positioned on the light-incident side of the PV element, and a non-conductive adhesive, where the adhesive and the conductor are positioned between the carrier film and the conductive layer.

Abstract: The present invention provides strategies for improving the adhesion among two or more of transparent conducting oxides, electrically conductive grid materials, and dielectric barrier layers. As a consequence, these strategies are particularly useful in the fabrication of heterojunction photovoltaic devices such as chalcogenide-based solar cells. When the barrier is formed and then the grid is applied to vias in the barrier, the structure has improved moisture barrier resistance as compared to where the barrier is formed over or around the grid. Adhesion is improved to such a degree that grid materials and dielectric barrier materials can cooperate to provide a hermetic seal over devices to protect against damage induced by environmental conditions, including damage due to water intrusion. This allows the collection grids to be at least partially exposed above the dielectric barrier, making it easy to make electronic connection to the devices.

Abstract: The present invention provides strategies for improving the adhesion among two or more of transparent conducting oxides, electrically conductive grid materials, and dielectric barrier layers. As a consequence, these strategies are particularly useful in the fabrication of heterojunction photovoltaic devices such as chalcogenide-based solar cells. When the barrier is formed and then the grid is applied to vias in the barrier, the structure has improved moisture barrier resistance as compared to where the barrier is formed over or around the grid. Adhesion is improved to such a degree that grid materials and dielectric barrier materials can cooperate to provide a hermetic seal over devices to protect against damage induced by environmental conditions, including damage due to water intrusion. This allows the collection grids to be at least partially exposed above the dielectric barrier, making it easy to make electronic connection to the devices.

Abstract: The present invention provides an improved photovoltaic cell assembly (10) that includes at least plurality of photovoltaic calls (20). The cells include a photoactive portion (24) sandwiched between a top electrically conductive structure (28) on some regions of a top surface (28) of the photoactive portion leaving exposed top surface on other regions; and an opposing conductive substrate layer (22). The improved photovoltaic cell assembly also includes a plurality of conductive elements (80); a first encapsulant layer (40) In contact with the top electrically conductive structure and the exposed fop surface of the photoactive portion; and a second encapsulant layer (50) in contact with the opposing conductive substrate layer, the encapsulants holding the conductive elements to the cell layers.

Abstract: The present invention provides strategies for improving the adhesion among two or more of transparent conducting oxides, electrically conductive grid materials, and dielectric barrier layers. As a consequence, these strategies are particularly useful in the fabrication of heterojunction photovoltaic devices such as chalcogenide-based solar cells. When the barrier is formed and then the grid is applied to vias in the barrier, the structure has improved moisture barrier resistance as compared to where the barrier is formed over or around the grid. Adhesion is improved to such a degree that grid materials and dielectric barrier materials can cooperate to provide a hermetic seal over devices to protect against damage induced by environmental conditions, including damage due to water intrusion. This allows the collection grids to be at least partially exposed above the dielectric barrier, making it easy to make electronic connection to the devices.