Abstract: A heat exchanger for a thermal management system of a display assembly includes layers, at least one of which is formed into sections of alternating height. A plurality of deposits of structural adhesive are provided, at least some of which are provided at the sections of alternating height to secure said layers to each other. Related display assemblies and methods are also provided.

Abstract: Methods of manufacturing a door frame subassembly for an electronic display assembly and related systems and apparatuses are disclosed. A material is extruded to form a frame. The material is bent into a rectangular shape with rounded corners to define an opening. Notches may be formed in the frame to facilitate the bending. A remaining gap in the material is joined, such as by a bracket at a lower portion of the opening to secure the frame to itself.

Abstract: A door frame for a display assembly of a display unit is disclosed, along with related display assemblies, units, systems, and methods. The door frame includes a body which is at least substantially planar. At least one vent is provided at the body. A cover is installable to a lip of the door frame which extends at least substantially perpendicular to the body and from an end thereof. The door frame subassembly is replaceable, such as to repair damaged covers offsite. The door frame may be formed by extrusion and bending.

Abstract: A heat exchanger for a thermal management system of a display assembly includes layers, at least one of which is formed into sections of alternating height. A plurality of deposits of structural adhesive are provided, at least some of which are provided at the sections of alternating height to secure said layers to each other. Related display assemblies and methods are also provided.

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

Abstract: Methods of manufacturing a door frame subassembly for an electronic display assembly and related systems and apparatuses are disclosed. A material is extruded to form a frame. The material is bent into a rectangular shape with rounded corners to define an opening. Notches may be formed in the frame to facilitate the bending. A remaining gap in the material is joined, such as by a bracket at a lower portion of the opening to secure the frame to itself.

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

Abstract: A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

Abstract: A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

Abstract: A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.