Patents by Inventor Matt Gortner

Matt Gortner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Near-hermetic package with flexible signal input and output
    Patent number: 11729933
    Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: August 15, 2023
    Assignee: TTM Technologies, Inc.
    Inventors: Michael Len, Nicholas S. Koop, Andrew Kempf, Matt Gortner
  • NEAR-HERMETIC PACKAGE WITH FLEXIBLE SIGNAL INPUT AND OUTPUT
    Publication number: 20220248553
    Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.
    Type: Application
    Filed: February 1, 2022
    Publication date: August 4, 2022
    Inventors: Michael Len, Nick Koop, Andrew Kempf, Matt Gortner