Patents by Inventor Matt Huber

Matt Huber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a multi-thickness electro-magnetic device
    Patent number: 11948724
    Abstract: Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 2, 2024
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Benjamin Hanson, Rodney Brune, Matt Huber
  • ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS, AND METHODS OF MANUFACTURING ELECTRO-MAGNETIC DEVICES HAVING MULTI-THICKNESS ELEMENTS
    Publication number: 20220406517
    Abstract: Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.
    Type: Application
    Filed: June 18, 2021
    Publication date: December 22, 2022
    Applicant: VISHAY DALE ELECTRONICS, LLC
    Inventors: Benjamin Hanson, Rodney Brune, Matt Huber