Patents by Inventor Matt Leck

Matt Leck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: D832250
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: October 30, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Glenn A. Wong, Jack Godfrey Wood, Marcus Hoggarth, Matt Leck
  • Patent number: D870068
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: December 17, 2019
    Assignee: EVA Automation, Inc.
    Inventors: Stuart Nevill, Jason Nims, Alexander van der Heijden, Matt Leck, Daniel Kayser