Patents by Inventor Matt Loesch

Matt Loesch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS devices and methods with controlled die bonding areas
    Patent number: 8240203
    Abstract: Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: August 14, 2012
    Assignee: Honeywell International Inc.
    Inventors: Galen Magendanz, Mark Eskridge, Matt Loesch
  • MEMS DEVICES AND METHODS WITH CONTROLLED DIE BONDING AREAS
    Publication number: 20100147075
    Abstract: Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.
    Type: Application
    Filed: December 11, 2008
    Publication date: June 17, 2010
    Applicant: Honeywell International Inc.
    Inventors: Galen Magendanz, Mark Eskridge, Matt Loesch