Patents by Inventor Matt Malley

Matt Malley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES
    Publication number: 20240194670
    Abstract: A multi-layer stacked semiconductor device includes a first integrated circuit device and a bonding insulator layer formed upon the first integrated circuit device. The bonding insulator layer includes an insulating material layer and an etch stop layer. The semiconductor device also includes a second integrated circuit device formed over the first integrated circuit device in a stacked configuration. The semiconductor device also includes a bonding insulator layer formed between the second integrated circuit device and the insulating material layer. The insulating material layer and the bonding insulator layer are bonded adjacent to one another.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 13, 2024
    Inventors: Ruqiang Bao, Fee Li Lie, Michael P. Belyansky, Matt Malley