Patents by Inventor Matt Richard McAlonis

Matt Richard McAlonis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9739543
    Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: August 22, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Chong Hun Yi, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller
  • Publication number: 20140216703
    Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
    Type: Application
    Filed: February 6, 2013
    Publication date: August 7, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: CHONG HUN YI, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller