Abstract: A method for performing DA (Dynamic Alignment) beam calibration in a plasma processing system is provided. The method including acquiring a positional difference, the positional difference is acquired using an optical imaging approach. The optical imaging approach comprising of positioning the wafer on the end effector, taking a still image of the wafer on the end effector, processing the still image to ascertain the center of the wafer and an end effector-defined center defined by the end effector, and determining the positional difference between the center of the wafer and the end effector-defined center defined by the end effector. The method also includes centering a wafer with respect to an end effector by compensating for a positional difference between the wafer and the end effector with robot movement compensation. The method including moving the wafer and the end effector through DA beams associated with a plasma processing module.

Abstract: A method for calibrating alignment of an end effector with respect to a chuck in a plasma processing system is disclosed. The method includes providing a first light beam from the end effector to said chuck, moving the end effector along a predefined calibration path such that the first light beam traverses a surface of the chuck, receiving a set of reflected light signals being generated at least when the surface reflects the first light beam during the moving, and analyzing the set of reflected light signals to identify three or more discontinuities, generated when the first light beam encounters an edge of the chuck. The method also includes determining three or more coordinate data points representing three or more points on the edge of the chuck, and determining a center of the chuck based on the three or more coordinate data points.

Abstract: A method for determining positions and offsets in a plasma processing system, the plasma processing system including at least a chuck and an upper electrode is provided. The method including moving a traversing assembly along a first plurality of paths to generate a first plurality of data sets, the traversing assembly including at least a light source, the light source providing a light beam, moving the traversing assembly along each path of the first plurality of paths causing the light beam to traverse the chuck and resulting in one or more data sets of the first plurality of data sets. The method also including receiving the first plurality of data sets and analyzing the first plurality of data sets to identify a first set of at least three discontinuities, wherein the first set of at least three discontinuities are related to three or more reflected light signals generated when the light beam encounters an edge of the chuck.

Abstract: A method for calibrating alignment of an end effector with respect to a chuck in a plasma processing system is provided. The method including positioning the end effector over the chuck and taking a still image of the chuck and the end effector. The method including processing the still image to ascertain the center of the chuck and the end effector-defined center defined by the end effector. The method including determining a positional difference between the end effector-defined center and the center of the chuck. The method also including providing the positional difference to a robot controller to control a robot mechanism to adjust the positional difference when the end effector transports a wafer.

Abstract: A method for calibrating alignment of an end effector with respect to a chuck in a plasma processing system is provided. The method including providing a first light beam from the end effector to said chuck. The method including moving the end effector along a predefined calibration path such that the first light beam traverses a surface of the chuck. The method also includes receiving a set of reflected light signals, the set of reflected light signals being generated at least when the surface reflects the first light beam during the moving. The method including analyzing the set of reflected light signals to identify three or more discontinuities. The three or more discontinuities are related to three or more reflected light signals generated when the first light beam encounters an edge of the chuck.

Abstract: A method for determining positions and offsets in a plasma processing system, the plasma processing system including at least a chuck and an upper electrode is provided. The method including moving a traversing assembly along a first plurality of paths to generate a first plurality of data sets, the traversing assembly including at least a light source, the light source providing a light beam, moving the traversing assembly along each path of the first plurality of paths causing the light beam to traverse the chuck and resulting in one or more data sets of the first plurality of data sets. The method also including receiving the first plurality of data sets and analyzing the first plurality of data sets to identify a first set of at least three discontinuities, wherein the first set of at least three discontinuities are related to three or more reflected light signals generated when the light beam encounters an edge of the chuck.

Abstract: A method for calibrating alignment of an end effector with respect to a chuck in a plasma processing system is provided. The method including positioning the end effector over the chuck and taking a still image of the chuck and the end effector. The method including processing the still image to ascertain the center of the chuck and the end effector-defined center defined by the end effector. The method including determining a positional difference between the end effector-defined center and the center of the chuck.

Abstract: A method for performing DA (Dynamic Alignment) beam calibration in a plasma processing system is provided. The method including acquiring a positional difference, the positional difference is acquired using an optical imaging approach. The optical imaging approach comprising of positioning the wafer on the end effector, taking a still image of the wafer on the end effector, processing the still image to ascertain the center of the wafer and an end effector-defined center defined by the end effector, and determining the positional difference between the center of the wafer and the end effector-defined center defined by the end effector. The method also includes centering a wafer with respect to an end effector by compensating for a positional difference between the wafer and the end effector with robot movement compensation. The method including moving the wafer and the end effector through DA beams associated with a plasma processing module.