Patents by Inventor Matt Shea

Matt Shea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for interconnecting die and substrate in an electronic package
    Patent number: 9293440
    Abstract: A method for interconnecting a die on a substrate of an electronic package. The method includes the steps of forming a plurality of free-end wire bonds on the die, wherein the free-end wire bonds are upstanding from the die, and encapsulating the free-end wire bonds in an encapsulation layer. Planarizing the encapsulation layer is performed so that the free-end wire bonds are exposed for electrical connection. Interconnecting the free-end wire bonds is provided by applying an interconnection layer on the encapsulation layer.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 22, 2016
    Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Michael Holm, Maurice Karpman, Matt Shea
  • METHOD FOR INTERCONNECTING DIE AND SUBSTRATE IN AN ELECTRONIC PACKAGE
    Publication number: 20150179609
    Abstract: A method for interconnecting a die on a substrate of an electronic package. The method includes the steps of forming a plurality of free-end wire bonds on the die, wherein the free-end wire bonds are upstanding from the die, and encapsulating the free-end wire bonds in an encapsulation layer. Planarizing the encapsulation layer is performed so that the free-end wire bonds are exposed for electrical connection. Interconnecting the free-end wire bonds is provided by applying an interconnection layer on the encapsulation layer.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 25, 2015
    Applicant: The Charles Stark Draper Laboratory, Inc.
    Inventors: Michael Holm, Maurice Karpman, Matt Shea