Patents by Inventor Matt Via

Matt Via has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12133148
    Abstract: A system for measuring brake data from a braking assembly of a vehicle. The braking assembly includes a floating portion that moves relative to brake pad wear. The system includes a brake sensor for each wheel. The brake sensors include a fixed sensing element and a target portion attached for movement with the floating portion. The sensing element generates a signal indicating a position of the target portion. The signal is used to determine brake pad thickness. The brake sensor also transmits the signal over a wireless vehicle area network for receipt and processing by a wireless hub in the vehicle area network. The vehicle area network can generate and transmit an alert and/or instructions for an autonomous vehicle based on the signal.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: October 29, 2024
    Assignee: Sensata Technologies, Inc.
    Inventors: Frank Sienkiewicz, Matt Via
  • Publication number: 20220221016
    Abstract: A system for measuring brake data from a braking assembly of a vehicle. The braking assembly includes a floating portion that moves relative to brake pad wear. The system includes a brake sensor for each wheel. The brake sensors include a fixed sensing element and a target portion attached for movement with the floating portion. The sensing element generates a signal indicating a position of the target portion. The signal is used to determine brake pad thickness. The brake sensor also transmits the signal over a wireless vehicle area network for receipt and processing by a wireless hub in the vehicle area network. The vehicle area network can generate and transmit an alert and/or instructions for an autonomous vehicle based on the signal.
    Type: Application
    Filed: April 22, 2020
    Publication date: July 14, 2022
    Inventors: Frank Sienkiewicz, Matt Via