Abstract: One aspect is a method that includes identifying a substantially uniform distribution of signal vias for a multi-layer circuit board based on a design file defining a layout that includes via groups in a two-to-one signal-to-ground via ratio configuration. A signal via pitch is determined as a center-to-center distance between a neighboring pair of signal vias. The signal via pitch is compared to a target minimum drilling distance. A ground via is identified proximate the neighboring pair of the signal vias. Based determining that the signal via pitch of the neighboring pair is less than the target minimum drilling distance, at least one of the signal vias is positioned closer to the ground via such that after the positioning, the signal via pitch of the neighboring pair meets or exceeds the target minimum drilling distance. The design file is modified to include the positioning of the signal vias.

Abstract: A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT.

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

Abstract: One aspect is a method that includes identifying a substantially uniform distribution of signal vias for a multi-layer circuit board based on a design file defining a layout. A signal via pitch is determined as a center-to-center distance between a neighboring pair of signal vias. The signal via pitch is compared to a target minimum drilling distance. A ground via is identified proximate the neighboring pair of the signal vias. Based determining that the signal via pitch of the neighboring pair is less than the target minimum drilling distance, at least one of the signal vias is positioned closer to the ground via such that after the positioning, the signal via pitch of the neighboring pair meets or exceeds the target minimum drilling distance. The design file is modified to include the positioning of the signal vias and is transmitted over a network to support circuit board manufacturing operations.

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

Abstract: A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT.

Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.

Abstract: One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.

Abstract: One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.

Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.

Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.

Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

Abstract: In one embodiment, a method includes positioning a first signal pad in a first layer of a printed circuit board and positioning a second signal pad in a second layer of the printed circuit board. The second signal pad is positioned to form an embedded capacitance between the first signal pad and the second signal pad. The embedded capacitance between the first signal pad and the second signal pad is configured to carry a signal between the first layer and the second layer absent a signal via.