Patents by Inventor Matteo Flotta
Matteo Flotta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9887146Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: GrantFiled: February 2, 2015Date of Patent: February 6, 2018Assignee: International Business Machines CorporationInventors: Matteo Flotta, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. van Kessel
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Publication number: 20150208555Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: ApplicationFiled: February 2, 2015Publication date: July 23, 2015Inventors: Matteo Flotta, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. van Kessel
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Patent number: 8944151Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: GrantFiled: May 28, 2008Date of Patent: February 3, 2015Assignee: International Business Machines CorporationInventors: Matteo Flotta, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. Van Kessel
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Publication number: 20120322243Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20120318673Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Patent number: 8303791Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: GrantFiled: August 26, 2008Date of Patent: November 6, 2012Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20120160459Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: ApplicationFiled: March 7, 2012Publication date: June 28, 2012Applicant: International Business Machines CorporationInventors: MATTEO FLOTTA, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. Van Kessel
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Patent number: 8168045Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: GrantFiled: May 20, 2011Date of Patent: May 1, 2012Assignee: International Business CorporationInventors: Matteo Flotta, Lubomyr T. Romanikiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 7964081Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: GrantFiled: August 24, 2007Date of Patent: June 21, 2011Assignee: International Business Machines CorporationInventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 7815968Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: GrantFiled: October 8, 2008Date of Patent: October 19, 2010Assignee: International Business Machines CorporationInventors: Gareth Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelmore, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
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Publication number: 20090294106Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: ApplicationFiled: May 28, 2008Publication date: December 3, 2009Inventors: Matteo Flotta, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. Van Kessel
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Publication number: 20090057154Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: ApplicationFiled: August 26, 2008Publication date: March 5, 2009Applicant: International Business Machines CorporationInventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20090050486Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Applicant: International Business Machines CorporationInventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Publication number: 20090032962Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: ApplicationFiled: October 8, 2008Publication date: February 5, 2009Applicant: International Business Machines Corporation (Yorktown)Inventors: Gareth Hougham, Leena P. Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelorme, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
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Patent number: 7452568Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: GrantFiled: February 4, 2005Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: Gareth Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelorme, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
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Publication number: 20070256937Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.Type: ApplicationFiled: May 4, 2006Publication date: November 8, 2007Applicant: International Business Machines CorporationInventors: Veeraraghavan Basker, John Cotte, Hariklia Deligianni, Matteo Flotta
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Publication number: 20070034526Abstract: An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate.Type: ApplicationFiled: August 12, 2005Publication date: February 15, 2007Inventors: Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Cooper, John Cotte, Hariklia Deligianni, Keith Kwietniak, Brett Baker-O'Neal, Matteo Flotta, Philippe Vereecken
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Publication number: 20060177568Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: ApplicationFiled: February 4, 2005Publication date: August 10, 2006Applicant: International Business Machines CorporationInventors: Gareth Hougham, Leena Buchwalter, Stephen Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey Gelorme, Kathleen Hinge, Anurag Jain, Sung Kang, John Knickerbocker
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Patent number: 6736906Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.Type: GrantFiled: April 10, 2002Date of Patent: May 18, 2004Assignee: International Business Machines CorporationInventors: John M. Cotte, Matteo Flotta, Kenneth J. McCullough, Wayne M. Moreau, Keith R. Pope, John P. Simons, Charles J. Taft
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Publication number: 20030192575Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.Type: ApplicationFiled: April 10, 2002Publication date: October 16, 2003Inventors: John M. Cotte, Matteo Flotta, Kenneth J. McCullough, Wayne M. Moreau, Keith R. Pope, John P. Simons, Charles J. Taft