Patents by Inventor Matteo Garavaglia

Matteo Garavaglia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250197198
    Abstract: A manufacturing process for microelectromechanical devices includes: on a first wafer forming a structural layer and a stop layer; defining a stop pad from the stop layer; forming a first microelectromechanical structure and a second microelectromechanical structure in the structural layer; forming a contact element protruding from a second wafer; sealing, at a first pressure, the first microelectromechanical structure in a first chamber and the second microelectromechanical structure and the stop pad in a second chamber; fluidically coupling the second chamber to an external environment; and sealing the second chamber at a second pressure. Sealing at the first pressure comprises bonding the second wafer to the first wafer so that the contact element rests on the stop pad. Fluidically coupling comprises defining fluidic passages at an interface between the contact element and the stop pad and opening an access hole through the second wafer in communication with the fluidic passages.
    Type: Application
    Filed: December 4, 2024
    Publication date: June 19, 2025
    Applicant: STMicroelectronics International N.V.
    Inventors: Giorgio ALLEGATO, Lorenzo CORSO, Matteo GARAVAGLIA, Federico VERCESI, Mikel AZPEITIA URQUIA
  • Publication number: 20250197199
    Abstract: A process for manufacturing microelectromechanical devices includes forming a dielectric layer and a structural layer on a substrate of a first semiconductor wafer and forming a first and a second microelectromechanical device in the structural layer. The first and second microelectromechanical devices are sealed respectively in a first chamber and in a second chamber at a first pressure. The first chamber is fluidically coupled to an external environment through the substrate and sealed at a second pressure different from the first pressure. To fluidically couple the first chamber to the outside, there are formed a stop layer between the dielectric layer and the structural layer and a cavity fluidically coupled to the first chamber in the dielectric layer. A channel is formed by etching the substrate in a position corresponding to the cavity and the stop layer, and the etching of the substrate is ended against the stop layer.
    Type: Application
    Filed: December 4, 2024
    Publication date: June 19, 2025
    Applicant: STMicroelectronics International N.V.
    Inventors: Federico VERCESI, Giorgio ALLEGATO, Lorenzo CORSO, Mikel AZPEITIA URQUIA, Matteo GARAVAGLIA
  • Publication number: 20240140783
    Abstract: A device and method for manufacturing a device comprising two semiconductor dice. The device is formed by a first die and a second die. The first die is of semiconductor material and integrates electronic components. The second die has a main surface, forms patterned structures, and is bonded to the first die. Internal electrical coupling structures electrically couple the main surface of the first die to the second die. External connection regions extend on the main surface of the first die. A package packages the first die, the second die and the internal electrical coupling structures and partially surrounds the external connection regions, the external connection regions partially protruding from the package.
    Type: Application
    Filed: October 18, 2023
    Publication date: May 2, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Mark Andrew SHAW, Lorenzo CORSO, Matteo GARAVAGLIA, Giorgio ALLEGATO
  • Publication number: 20240043265
    Abstract: Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 8, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Giorgio ALLEGATO, Silvia NICOLI, Anna ALESSANDRI, Matteo GARAVAGLIA
  • Patent number: 10954121
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 23, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Giorgio Allegato, Laura Oggioni, Matteo Garavaglia, Roberto Somaschini
  • Publication number: 20200123004
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 23, 2020
    Inventors: Giorgio ALLEGATO, Laura OGGIONI, Matteo GARAVAGLIA, Roberto SOMASCHINI
  • Patent number: 10570009
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: February 25, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giorgio Allegato, Laura Oggioni, Matteo Garavaglia, Roberto Somaschini
  • Publication number: 20190185318
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Inventors: Giorgio Allegato, Laura Oggioni, Matteo Garavaglia, Roberto Somaschini
  • Patent number: 10227233
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: March 12, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giorgio Allegato, Laura Oggioni, Matteo Garavaglia, Roberto Somaschini
  • Publication number: 20170369309
    Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
    Type: Application
    Filed: December 14, 2016
    Publication date: December 28, 2017
    Inventors: Giorgio ALLEGATO, Laura OGGIONI, Matteo GARAVAGLIA, Roberto SOMASCHINI
  • Patent number: 9327964
    Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: May 3, 2016
    Assignee: STMicroelectronics S.r.l.
    Inventors: Giorgio Allegato, Marco Ferrera, Matteo Garavaglia, Lorenzo Corso
  • Publication number: 20150115378
    Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
    Type: Application
    Filed: October 27, 2014
    Publication date: April 30, 2015
    Inventors: Giorgio Allegato, Marco Ferrera, Matteo Garavaglia, Lorenzo Corso
  • Publication number: 20060096324
    Abstract: A waveguide includes a substrate, lower cladding having a decreasing cross-section, and a core having an increasing cross-section. The lower cladding is formed on a substrate, and the waveguide core is formed on the lower cladding. The waveguide core includes a first tract of constant thickness and a second tract of varying thickness, and finally side and upper cladding of the waveguide is formed. In order to obtain a waveguide having a segment of varying thickness in an easy, controlled and adiabatic manner, two series of operations are carried out to form the lower cladding and the core.
    Type: Application
    Filed: November 3, 2005
    Publication date: May 11, 2006
    Inventors: Pietro Montani, Matteo Garavaglia, Fabio Fusari, Marta Mottura