Patents by Inventor Matthew A. Grayson

Matthew A. Grayson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240027554
    Abstract: A system to improve a product based on a relaxation response includes a memory configured to store relaxation response data of a sample. The relaxation response data includes time data and amplitude data. A processor is operatively coupled to the memory and configured to convert the relaxation response data to linear-amplitude versus log-time data. The processor also performs a least-squares fit of the converted relaxation response data to a heavy-tail function to determine one or more fit parameter values. The processor also updates a design for the sample based at least in part on the one or more fit parameter values.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 25, 2024
    Inventors: Matthew A. Grayson, Jiajun Luo, Can Aygen
  • Publication number: 20230395112
    Abstract: According to certain aspects of the present disclosure, a device is provided. The device includes a thin film of cobalt. A platinum layer is disposed on the thin film of cobalt. An aluminum layer is disposed on the platinum layer. The aluminum layer disposed on the platinum layer encapsulates the thin film of cobalt. A plurality of electrical contacts is in electrical communication with the thin film of cobalt. Two electrical contacts of the plurality of electrical contacts are configured to receive a write-current therebetween. Four electrical contacts of the plurality of contacts are configured for reading a 4-point resistance.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 7, 2023
    Inventors: Matthew A. Grayson, Pedram Khalili-Amiri, Chulin Wang, Claire Cecelia Onsager, Sevde Nur Arpaci, Victor Lopez Dominguez
  • Patent number: 8517605
    Abstract: An integrated circuit chip is defined by a stack of several interconnected layers. The integrated circuit chip includes at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: August 27, 2013
    Assignee: Northwestern University
    Inventors: Matthew A. Grayson, Seda Memik, Jieyi Long, Chuanle Zhou, Andrea Grace Klock
  • Publication number: 20110110396
    Abstract: An integrated circuit chip is defined by a stack of several interconnected layers. The integrated circuit chip includes at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples.
    Type: Application
    Filed: September 20, 2010
    Publication date: May 12, 2011
    Inventors: Matthew A. Grayson, Seda Memik, Jieyi Long, Chuanle Zhou, Andrea Grace Klock