Patents by Inventor Matthew A. Heller

Matthew A. Heller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Notification of events and apportioning of process data in a meter
    Patent number: 12092503
    Abstract: A meter electronics (20) configured to notify of an event and apportion process data is provided. The meter electronics (20) comprises a memory (230) configured to continuously store the process data (410) for a duration (412), a processor (210) communicatively coupled to the memory (230). The processor (210) is configured to detect one or more events (430) in the process data (410) and at least one of generate a notification (460) and apportion the process data (410) based on the detected one or more events (430).
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: September 17, 2024
    Assignee: MICRO MOTION, INC.
    Inventors: Andrew S. Kravitz, Matthew A. Heller, Nathan C. Murra, Tonya L. Wyatt
  • NOTIFICATION OF EVENTS AND APPORTIONING OF PROCESS DATA IN A METER
    Publication number: 20220307883
    Abstract: A meter electronics (20) configured to notify of an event and apportion process data is provided. The meter electronics (20) comprises a memory (230) configured to continuously store the process data (410) for a duration (412), a processor (210) communicatively coupled to the memory (230). The processor (210) is configured to detect one or more events (430) in the process data (410) and at least one of generate a notification (460) and apportion the process data (410) based on the detected one or more events (430).
    Type: Application
    Filed: September 25, 2019
    Publication date: September 29, 2022
    Applicant: MICRO MOTION, INC.
    Inventors: Andrew S. KRAVITZ, Matthew A. HELLER, Nathan C. MURRA, Tonya L. WYATT
  • Electronic package with stacked connections and method for making same
    Patent number: 6653575
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: November 25, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections and method for making same
    Patent number: 6617528
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: September 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections and method for making same
    Patent number: 6574113
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: June 3, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections and method for making same
    Publication number: 20010014015
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Application
    Filed: January 17, 2001
    Publication date: August 16, 2001
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections and method for making same
    Publication number: 20010001593
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Application
    Filed: January 17, 2001
    Publication date: May 24, 2001
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections and method for making same
    Publication number: 20010001594
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Application
    Filed: January 17, 2001
    Publication date: May 24, 2001
    Inventors: Gregg J. Armezzani, Matthew A. Heller
  • Electronic package with stacked connections
    Patent number: 6198634
    Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Matthew A. Heller