Patents by Inventor Matthew A. Purdy
Matthew A. Purdy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8676538Abstract: A method, apparatus and a system, for provided for performing a dynamic weighting technique for performing fault detection. The method comprises processing a workpiece and performing a fault detection analysis relating to the processing of the workpiece. The method further comprises determining a relationship of a parameter relating to the fault detection analysis to a detected fault and adjusting a weighting associated with the parameter based upon the relationship of the parameter to the detected fault.Type: GrantFiled: November 2, 2004Date of Patent: March 18, 2014Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 7849366Abstract: A method includes receiving fault classification data associated with a fault condition and estimating at least one yield parameter based on the fault classification data. A system includes a fault classification unit and a yield estimation unit. The fault classification unit is adapted to generate fault classification data associated with a fault condition, and the yield estimation unit is adapted to estimate at least one yield parameter based on the fault classification data.Type: GrantFiled: March 26, 2004Date of Patent: December 7, 2010Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 7715941Abstract: The present invention provides a method and apparatus for scheduling a plurality of processing tools. The method comprises providing a first processing tool and a plurality of second processing tools, selecting one of the plurality of second processing tools, and determining a target output parameter of a combination of processing tools comprising said first processing tool and said selected one of the plurality of second processing tools. The method also includes determining at least one input parameter of a process model for controlling the first processing tool based upon the target output parameter of the combination of processing tools.Type: GrantFiled: November 3, 2004Date of Patent: May 11, 2010Assignee: Advanced Micro DevicesInventor: Matthew A. Purdy
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Patent number: 7695986Abstract: The present invention provides a method and apparatus for modifying process selectivities based on process state information. The method includes accessing process state information associated with at least one material removal process, determining at least one selectivity based on the process state information, and modifying at least one process parameter of said material removal process based on said at least one determined selectivity.Type: GrantFiled: August 1, 2005Date of Patent: April 13, 2010Assignee: GlobalFoundries, Inc.Inventors: Matthew A. Purdy, Matthew Ryskoski, Richard J. Markle
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Patent number: 7473566Abstract: A method includes defining a plurality of objectives for a film formation process and employing a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process. A system includes a film formation unit and a process control unit. The film formation unit is adapted to perform a film formation process in accordance with an operating recipe. The process control unit is adapted to define a plurality of objectives for the film formation process and employ a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process.Type: GrantFiled: February 3, 2004Date of Patent: January 6, 2009Assignee: Advanced Micro Devices, Inc.Inventors: Matthew A. Purdy, Robert J. Chong
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Patent number: 7460968Abstract: The present invention provides a method and apparatus for selecting wafers for sampling. The method includes determining a plurality of sampling rules associated with at least one of a plurality of wafers and selecting at least one wafer for sampling based on the plurality of sampling rules.Type: GrantFiled: September 30, 2005Date of Patent: December 2, 2008Assignee: Advanced Micro Devices, Inc.Inventors: Richard P. Good, Matthew A. Purdy
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Patent number: 7299106Abstract: The present invention provides a method that includes determining a jeopardy count associated with at least one processing tool and selecting at least one wafer based upon the jeopardy count, the at least one wafer having been processed by the at least one processing tool.Type: GrantFiled: April 19, 2005Date of Patent: November 20, 2007Assignee: Advanced Micro Devices, Inc.Inventors: Cabe W. Nicksic, Matthew A. Purdy
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Patent number: 7296103Abstract: The present invention is generally directed to various methods and systems for dynamically controlling metrology work in progress. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to control metrology work flow to at least one metrology tool, identifying a plurality of wafer lots that are in a metrology queue wherein the wafer lots are intended to be processed in at least one metrology tool, and wherein the metrology control unit selects at least one of the wafer lots for metrology processing in the at least one metrology tool and selects at least one other of the plurality of wafer lots to be removed from the metrology queue based upon the metrology processing of the selected at least one wafer lot in the at least one metrology tool.Type: GrantFiled: October 5, 2004Date of Patent: November 13, 2007Assignee: Advanced Micro Devices, Inc.Inventors: Matthew A. Purdy, Cabe W. Nicksic
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Patent number: 7153709Abstract: The present invention is generally directed to various methods and systems for calibrating degradable components using process state data. In one illustrative embodiment, the method includes providing a tool comprised of at least one process chamber, providing at least one process state sensor that is adapted to obtain process state data regarding at least one characteristic of a process environment established in the chamber in performance of a process operation, operatively coupling at least one of a new or repaired degradable component to the tool, and calibrating the new or repaired degradable component based upon the process state data. In further embodiments, the method comprises processing a plurality of additional workpieces in the tool after the new or repaired degradable components have been calibrated using process state data in accordance with one aspect of the present invention.Type: GrantFiled: August 31, 2004Date of Patent: December 26, 2006Assignee: Advanced Micro Devices, Inc.Inventors: Matthew A. Purdy, Richard J. Markle
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Patent number: 7131937Abstract: The present invention relates generally to exercising equipment, and more particularly, to an improved multi-use weight lifting apparatus. The present weight lifting apparatus comprises a frame (12), a vertical guide member (52), at least one horizontal guide member (46), a weight bearing bar (60), and a safety catch mechanism (70). This weight lifting apparatus allows a weight lifter to perform exercise with vertical and horizontal ranges of motion that simulate the natural motions of using free weights while providing safety mechanisms that are not available with free weights.Type: GrantFiled: November 30, 2001Date of Patent: November 7, 2006Assignee: Max Rack, Inc.Inventors: Stephen A. Skilken, Matthew A. Purdy
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Patent number: 7100081Abstract: A method includes receiving a current residual vector. The current residual vector is compared to a plurality of historical residual vectors. Each historical residual vector has an associated fault classification code. At least one of the historical residual vectors is selected responsive to determining that the current residual vector matches at least one of the historical residual vectors. A fault condition is classified based on the fault classification code associated with the selected historical residual vector.Type: GrantFiled: October 9, 2003Date of Patent: August 29, 2006Assignee: Advanced Micro Devices, Inc.Inventors: Matthew A. Purdy, Robert J. Chong, Gregory A. Cherry, Richard J. Markle
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Patent number: 7076321Abstract: The present invention is generally directed to various methods and systems for dynamically adjusting metrology sampling based upon available metrology capacity. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to determine a baseline metrology sampling rate for at least one metrology operation, determining available metrology capacity, and providing the determined available metrology capacity to the metrology control unit wherein the metrology control unit determines a new metrology sampling rate based upon the determined available metrology capacity.Type: GrantFiled: October 5, 2004Date of Patent: July 11, 2006Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 7069098Abstract: The present invention is generally directed to various methods and systems for prioritizing material to clear exception conditions. In one illustrative embodiment, the method includes providing a plurality of workpieces, each of the workpieces having an associated quantity of material that cannot be processed until the workpiece has been processed, and determining a priority for processing each of the plurality of workpieces based upon at least the associated quantity of material that cannot be processed.Type: GrantFiled: August 2, 2004Date of Patent: June 27, 2006Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 7067333Abstract: A method for controlling a process includes determining incoming state information associated with the process. A plurality of control models associated with the process is provided. A confidence metric is determined for each of the control models based on the incoming state information. The one of the plurality of control models having the highest associated confidence metric is selected. A control action for determining at least one parameter in an operating recipe used to implement the process is generated using the selected control model. A system includes a process tool and a process controller. The process tool is configured to process a workpiece in accordance with an operating recipe.Type: GrantFiled: June 28, 2002Date of Patent: June 27, 2006Assignee: Advanced Micro Devices, Inc.Inventors: Alexander J. Pasadyn, Matthew A. Purdy
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Patent number: 7069103Abstract: A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.Type: GrantFiled: June 28, 2002Date of Patent: June 27, 2006Inventors: Christopher A. Bode, Matthew A. Purdy
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Patent number: 7026170Abstract: The present invention is generally directed to various methods of controlling optical properties of a capping insulating layer on memory devices, and system for performing same. The method includes forming a first capping layer that includes at least one process layer above a memory cell formed above a first semiconducting substrate, measuring at least one optical characteristic of the first capping layer and determining at least one parameter of a deposition process to form a second capping layer that includes at least one process layer above a memory cell formed above a second semiconducting substrate based upon the measured optical characteristic of the first capping layer.Type: GrantFiled: June 11, 2003Date of Patent: April 11, 2006Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 6991945Abstract: A method and apparatus is provided for fault detection spanning multiple processes. The method comprises receiving operational data associated with a first process, receiving operational data associated with a second process, which is downstream to the first process and performing fault detection analysis based on the operational data associated with the first process and second process using a common fault detection unit.Type: GrantFiled: August 30, 2002Date of Patent: January 31, 2006Assignee: Advanced Micro Devices, Inc.Inventors: Howard E. Castle, Matthew A. Purdy, Gregory A. Cherry, Richard J. Markle, Eric O. Green, Michael L. Miller, Brian K. Cusson
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Patent number: 6988045Abstract: The present invention is generally directed to various methods and systems for adaptive metrology sampling plans that may be employed to monitor various manufacturing processes. In one example, the method includes creating a plurality of metrology sampling rules, assigning each of the metrology sampling rules a sampling weight value, identifying at least one workpiece that satisfies at least one of the metrology sampling rules, assigning the sampling weight value for each of the satisfied metrology sampling rules with the identified workpieces that satisfy the rules, and indicating a metrology operation should be performed when a cumulative total of the sampling weight values is at least equal to a pre-established trigger value.Type: GrantFiled: August 4, 2003Date of Patent: January 17, 2006Assignee: Advanced Micro Devices, Inc.Inventor: Matthew A. Purdy
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Patent number: 6988225Abstract: A method and an apparatus are provided for verifying a fault detection result in a system. The apparatus includes an interface and a control unit. The interface is adapted to receive data associated with a process operation and adapted to receive information provided by a process controller associated with the process operation. The control unit, which is communicatively coupled to the interface, is adapted to perform a fault detection analysis based on the data associated with the process operation and verify a result of the fault detection analysis based on the information provided by the process controller.Type: GrantFiled: October 31, 2002Date of Patent: January 17, 2006Assignee: Advanced Micro Devices, Inc.Inventors: Matthew A. Purdy, Richard J. Markle, Timothy L. Jackson
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Patent number: 6978189Abstract: A method and an apparatus for matching data related to an integrated metrology tool and a standalone metrology tool. At least one semiconductor wafer is processed. An integrated metrology tool and/or a standalone metrology tool is matched based upon a difference between metrology data relating to a processed semiconductor wafer acquired by the integrated metrology tool and metrology data acquired by the standalone metrology tool, using a controller.Type: GrantFiled: May 28, 2002Date of Patent: December 20, 2005Inventors: Christopher A. Bode, Matthew A. Purdy, Alexander J. Pasadyn