Patents by Inventor Matthew A. THORSETH

Matthew A. THORSETH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • Electroplating bath analysis
    Patent number: 9612217
    Abstract: Electrochemical impedance spectroscopy is used to determine the amount of organic additive in a metal electroplating bath.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronics Materials LLC
    Inventor: Matthew A. Thorseth
  • PLATING METHOD
    Publication number: 20150376807
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Matthew A. THORSETH, Mark A. SCALISI, Luis A. GOMEZ, Bryan LIEB, Rebecca Lea Hazebrouck, Mark LEFEBVRE
  • ELECTROPLATING BATH ANALYSIS
    Publication number: 20150300970
    Abstract: Electrochemical impedance spectroscopy is used to determine the amount of organic additive in a metal electroplating bath.
    Type: Application
    Filed: April 22, 2015
    Publication date: October 22, 2015
    Inventor: Matthew A. THORSETH