Patents by Inventor Matthew Aaron Munn

Matthew Aaron Munn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling stamp for ground bonding strap
    Patent number: 9352374
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: May 31, 2016
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Matthew Aaron Munn, Doug Klamm
  • Method for Assembling Stamp for Ground Bonding Strap
    Publication number: 20140260490
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Application
    Filed: May 27, 2014
    Publication date: September 18, 2014
    Applicant: CenturyLink Intellectual Property LLC
    Inventors: Matthew Aaron Munn, Doug Klamm
  • Stamp for ground bonding strap
    Patent number: 8770007
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: July 8, 2014
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Matthew Aaron Munn, Doug Klamm
  • Stamp for Ground Bonding Strap
    Publication number: 20130233041
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Application
    Filed: May 6, 2013
    Publication date: September 12, 2013
    Applicant: CenturyLink Intellectual Property LLC
    Inventors: Matthew Aaron Munn, Doug Klamm
  • System and method for creating a ground bonding strap
    Patent number: 8453486
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: June 4, 2013
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Matthew Aaron Munn, Doug Klamm
  • SYSTEM AND METHOD FOR CREATING A GROUND BONDING STRAP
    Publication number: 20090282888
    Abstract: A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
    Type: Application
    Filed: March 24, 2009
    Publication date: November 19, 2009
    Inventors: Matthew Aaron Munn, Doug Klamm
  • Ground bonding strap
    Patent number: 7591696
    Abstract: A system and method for a ground bonding strap. The ground bonding strap includes a length of cable. The ground bonding strap includes multiple connectors disposed at intervals along the length of the cable. The multiple connectors being flattened in the cable and defining a pair of receptacles. The pair of receptacles are separated by an indentation.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: September 22, 2009
    Assignee: Embarq Holdings Company, LLC
    Inventors: Matthew Aaron Munn, Doug Klamm