Abstract: A method and apparatus for heat sinking for multiple high power circuit board modules, is provided. One implementation involves providing a compact nested fin integral heat sink assembly for each high power circuit board module, and positioning fin sections on the heat sink assembly such that a plurality of nested fin sections emanate from each board side heat spreader plate of the assembly, thereby providing efficient airflow gap, pressure drop, and heat sink base spreading performance. The fin section can be placed essentially directly over high power components on each board module to minimize spreading resistance in a heat sink base of the assembly. The fin sections on each board module side provide channel depth without extending from an opposite side heat sink base, thereby increasing fin surface area for each local region of fins from either heat sink base.

Abstract: A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop.

Abstract: A tamper sensing circuit is provided for an electrical device wherein an enclosure may be opened to access data by a user that does not possess the ability to achieve normal access by satisfying data security measures such as use of a password. A screw used to secure enclosure halves together is connected by a conductive coating at the enclosure member surface into which the screw is threaded to connect a tamper sensing circuit to the device ground potential. A tamper sensing circuit output node is maintained at the circuit ground potential as long as the screw is in electrical contact with the enclosure conductive coating. When the screw is disengaged from the enclosure member threaded opening, the output node is no longer grounded and rises to a supplied electrical potential indicating tampering and enabling appropriate corrective action.

Abstract: There is disclosed an apparatus and method for protecting electronic devices against excessive heat build-up and particulate infiltration while implementing EMC shielding.

Abstract: A chassis for a computer, computer related or other electronic device includes a door that closes an access opening in the chassis when in the closed position and permits access to the interior of the chassis when opened for a user or service technician. A latch releasably secures the door in the closed position and is operable by a user or service technician for opening the door from the closed position and closing the door from the open position without the benefit of a screwdriver, wrench or other tool. In selected embodiments, the latch is biased to account for compression reaction forces of a seal or gasket surrounding the access opening while still providing for manual manipulation of the door and access to the interior of the chassis.

Abstract: A cover is operable to seat and unseat electronic components. The cover is detached from an enclosure exposing an access opening. An electronic component, such as an expansion card, is inserted by an operator into guide rails housed within the opening. A first catch mechanism of the cover pivotally engages the opening so as to form a lever arm. A second catch mechanism connects with a mating catch of the electronic component. The component traverses the guide rails according to the rotation of the cover. The mechanical advantage realized by the cover overcomes the forces associated with seating and detaching connector pins of the electronic component with sockets of an expansion bus. The cover detaches from both the component and the enclosure prior to being repositioned to overlap the opening.

Abstract: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.

Abstract: A bracket/collar is disclosed to circumscribe an integrated circuit card into an electrical or an optical connector. The bracket/collar has several features, such as grooves, to hold the circuit card into the bracket; the grooves may be on any available edge not mating with or held by the connector, and may hold a corner or other feature of the circuit card. Another feature of the bracket/collar is a mechanism, such as a hook or notch, to connect with the connector. Yet another feature of the bracket/collar is that, by its shape, it provides sufficient loading of the circuit card into the connector so that when dropped or otherwise mechanically shocked, the circuit card is not displaced from its connector. The bracket/collar is especially useful to secure DIMM memory cards within their electrical connectors in handheld computers.

Abstract: A battery latch for a portable electronic device is made of a resilient material and includes integral spring members that make the use of a separate steel spring unnecessary. The battery latch is low-profile, allowing it to be easily integrated into a housing with limited space. The battery latch includes protruding members that are biased by the integral spring members into a recess that is designed to receive the battery pack. The protruding members include a beveled or curved surface that the battery pack presses against when the battery pack is being pressed into place. The force of the battery pack overcomes the bias of the integral spring members and forces the battery latch into the housing, thereby making room for the battery pack to slide past the protruding members of the battery latch. The battery pack includes recesses that align with the protruding members of the battery latch once the battery pack is fully seated in the housing.

Abstract: A cover is operable to seat and unseat electronic components. The cover is detached from an enclosure exposing an access opening. An electronic component, such as an expansion card, is inserted by an operator into guide rails housed within the opening. A first catch mechanism of the cover pivotally engages the opening so as to form a lever arm. A second catch mechanism connects with a mating catch of the electronic component. The component traverses the guide rails according to the rotation of the cover. The mechanical advantage realized by the cover overcomes the forces associated with seating and detaching connector pins of the electronic component with sockets of an expansion bus. The cover detaches from both the component and the enclosure prior to being repositioned to overlap the opening.

Abstract: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.

Abstract: An enclosure arrangement includes a chassis, and a central electronics complex. The central electronics complex has a cage removably positioned within the chassis. The cage has an open top providing access into the interior of the cage. The central electronics complex also includes a backplane arranged in a horizontal position, and forming a floor of the cage. The backplane has at least one card slot on a surface thereof. The central electronics complex further includes at least one circuit board disposed in the interior of the cage and being removably received by the card slot. The circuit board is arranged in a vertical position so that a gravitational force helps retain the circuit board in the card slot. The cage is removably positioned within the chassis. At least one rail connects the cage to the chassis. The cage is disposed on the rail, and is guidable into the chassis using the rail.

Abstract: A panel latch 10 includes at least one flexible latch member 24, 26 having a base portion 36, a first leg 32, and a second leg 34 attached to the first leg via the base portion. The flexible latch member 24, 26 further has a latch portion 46 and a stop member 82 disposed on the first leg 32. The latch portion 46 is separated from the stop member 82 to accommodate therebetween at least two separate parts 12, 14 that are to be latched together. The legs 32, 34 of the flexible latch member can be flexed so as to shift the latch portion 46 and the stop member 82 in a direction toward the second leg 34 to allow the two parts 12, 14 to be unlatched from each other. A generally U-shaped, rigid latch retaining member 28 is provided that has a first leg 54 with free end. A second leg 56 of the latch retaining member 28 is connected to the flexible latch member 24, 26.

Abstract: An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.

Abstract: A computer arrangement includes an electronics enclosure located within a computer housing, which is divided into a plurality of physically separated cooling zones. The enclosure has a plurality of inlet and outlet openings. Each cooling zone is in registration with respective inlet and outlet openings. A backplane is disposed within the electronics enclosure, and has front and rear surfaces. A first electrical component is attached to one of the surfaces and is arranged in one of the cooling zones. At least one circuit board is disposed within the electronics enclosure and is attached to the front surface of the backplane. The circuit board has a second electrical component attached to a surface thereof, which is arranged in another one of the cooling zones. A system operation card is disposed within the electronics enclosure, and is attached to the rear surface of the backplane.

Abstract: An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.