Abstract: Metal films, such as molybdenum films are deposited on a semiconductor substrate having one or more recessed features in a deposition process modulated by addition of a halogen-containing compound (e.g., an alkyl halide). In some implementations, a pre-treatment of a substrate with a halogen-containing compound is performed prior to contacting the substrate with a metal-containing precursor and a reducing agent. In some embodiments, the pre-treatment is performed such that the halogen-containing compound modifies the surface of the substrate to a greater degree in a field region of the substrate and near the opening of the recessed feature, as compared to the bottom portion of the recessed feature, where the modification of the substrate inhibits deposition of the metal. As a result, deposition of metals with improved step coverage can be achieved. In some implementations, modulation of deposition by halogen-containing compounds is used to achieve bottom-up metal growth in recessed features.

Abstract: A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.

Abstract: Molybdenum-DAD precursors are described. Methods for depositing molybdenum-containing films on a substrate are described. The substrate is exposed to a molybdenum-DAD precursor and a reactant to form the molybdenum-containing film (e.g., elemental molybdenum, molybdenum oxide, molybdenum carbide, molybdenum silicide, molybdenum nitride). The exposures can be sequential or simultaneous.

Abstract: A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.

Abstract: Shear tools are described that are driven by a power assembly. In one version, the shear tools include a pivotally movable pair of lever arms. Upon activation of the power tool, the lever arms of the shear tool are pivotally displaced and urge a die along a shearing plane relative to another stationary die retained by the shear tool. In another version, the shear tools include a carriage and link assembly. Upon engagement and activation with a power assembly or power tool, a movable die is urged past a stationary die. Also described are systems and related methods utilizing the shear tools which enable convenient shearing or severing of workpieces such as strut channel.

Abstract: Shear tools are described that are driven by a power assembly. In one version, the shear tools include a pivotally movable pair of lever arms. Upon activation of the power tool, the lever arms of the shear tool are pivotally displaced and urge a die along a shearing plane relative to another stationary die retained by the shear tool. In another version, the shear tools include a carriage and link assembly. Upon engagement and activation with a power assembly or power tool, a movable die is urged past a stationary die. Also described are systems and related methods utilizing the shear tools which enable convenient shearing or severing of workpieces such as strut channel.

Abstract: A punch tool for forming holes or apertures in workpieces. The tool includes a primary cylinder containing a movable ram and a secondary cylinder containing another movable ram. The primary and secondary cylinders are in hydraulic communication with each other. The primary cylinder is releasably engageable with a powered press tool and various dies or punches can be attached at the secondary cylinder. Systems of powered tools and the punch tools, and methods of forming holes in workpieces using the punch tools.

Abstract: Tool heads for use with a powered actuator are described. The tool heads are configured for pressing or crimping fittings and particularly electrical connectors. Generally, the tool head includes a frame, a roller carriage, and a pair of pivotally attached jaws that are biased to an open position. The tool head may in certain versions, include provisions that enable the tool head to be releasably engaged with a powered actuator such as a hydraulic actuator. Also described are tool systems using the various tool heads.

Abstract: Fabricating a semiconductor structure including forming a nanocrystalline core from a first semiconductor material, forming a nanocrystalline shell from a second, different, semiconductor material that at least partially surrounds the nanocrystalline core, wherein the nanocrystalline core and the nanocrystalline shell form a quantum dot. Fabrication further involves forming an insulator layer encapsulating the quantum dot to create a coated quantum dot, and forming an additional insulator layer on the coated quantum dot using an Atomic Layer Deposition (ALD) process.

Abstract: Techniques and mechanisms for synthesizing quantum dot structures. In an embodiment, a first reaction is performed to dissolve a precursor of a semiconductor material, wherein water is created as a by-product of the first reaction. Some or all of the water is removed and another chemical compound is added, wherein the chemical compound is a primary alcohol or a 1,2-diol. After the addition of the chemical compound, a second reaction is performed to grow at least some nanocrystalline portion of the quantum dot. In another embodiment, the chemical compound is 1,2-hexanediol, 1,2-dodecanediol or 1-octadecanol.

Abstract: A punch tool for forming holes or apertures in workpieces is described. The tool includes a primary cylinder containing a movable ram and a secondary cylinder containing another movable ram. The primary and secondary cylinders are in hydraulic communication with each other. The primary cylinder is releasably engageable with a powered press tool and various dies or punches can be attached at the secondary cylinder. Also described are systems of powered tools and the punch tools, and methods of forming holes in workpieces using the punch tools.

Abstract: Irregular large volume semiconductor coatings for quantum dots (QDs) and the resulting quantum dot materials are described. In an example, a semiconductor structure includes a quantum dot structure having an outermost surface. A crystalline semiconductor coating is disposed on and completely surrounds the outermost surface of the quantum dot structure. The crystalline semiconductor coating has an irregular outermost geometry.

Abstract: Fabricating a semiconductor structure including forming a nanocrystalline core from a first semiconductor material, forming a nanocrystalline shell from a second, different, semiconductor material that at least partially surrounds the nanocrystalline core, wherein the nanocrystalline core and the nanocrystalline shell form a quantum dot. Fabrication further involves forming an insulator layer encapsulating the quantum dot to create a coated quantum dot, and forming an additional insulator layer on the coated quantum dot using an Atomic Layer Deposition (ALD) process.

Abstract: Alloyed nanocrystals and quantum dots having alloyed nanocrystals are described. In an example, a quantum dot includes an alloyed Group II-VI nanocrystalline core. The quantum dot also includes a Group II-VI nanocrystalline shell having a semiconductor material composition different from the alloyed Group II-VI nanocrystalline core. The Group II-VI nanocrystalline shell is bonded to and completely surrounds the alloyed Group II-VI nanocrystalline core.

Abstract: A rotor assembly end turn cooling system and method in which cooling fluid is introduced at both ends of each cooling fluid passageway and at various points therebetween and spent cooling fluid is exhausted through exhaust openings disposed at various points between the ends of each cooling fluid passageway, including near the end turn corners. Multi-layered bore baffle shells and/or helical exhaust ducts having multiple channels control the flow of cooling fluid through the passageways and into axial rotor slots for expulsion into the rotor-stator gap. Each duct or channel may increase in cross-sectional area in the flow direction to maintain constant fluid flow velocity in the duct or channel. Improved end turn cooling and reduced cooling fluid temperatures maintain more consistent temperatures in the end turns and reduce the maximum hot-spot temperature to provide greater generator power densities and longer rotor coil insulation life.