Abstract: A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.