Abstract: Examples of computing devices including a processor, memory, and a display device housed within the same enclosure are described. In examples, the display device, which may include a cover glass, may be attached to the enclosure using a multilayer adhesive member, the multilayer adhesive including a first adhesive layer and a second adhesive layer disposed on opposite sides of a foam layer. The first and/or second adhesive layers may include two or more layers of a pressure sensitive adhesive (PSA), which may be separated using one or more adhesive carrier films. In examples, the first and/or second adhesive layers may include a low tack (e.g. removable) PSA for adhering to surfaces of the display and enclosure and for facilitation removal and re-workability of the adhesive joint.

Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.

Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.

Abstract: An electronic device may have a housing. Components such as keys may be mounted in openings in the housing. The housing may include a display housing portion and a base portion that are coupled using hinge structures. The keys may be used to form a keyboard in the base portion of the housing. Sensitive circuitry such as sensitive wireless circuitry may be shielded from electromagnetic interference by shielding the openings with a layer of conductive material. The layer of conductive material may be a metal layer that forms part of a reflector for a backlight structure. The backlight structure may be used to provide backlight for keys in the keyboard. The keyboard may include a support structure having openings through which the backlight passes to reach the keys. The openings may be bridged using conductive paths so that the support structure serves as a radio-frequency shielding structure.

Abstract: An electronic device is provided with a display such as a liquid crystal display. The display includes a liquid crystal display module an array of display pixels. A backlight unit is used to provide backlight illumination to the display module. A shutter module having local dimming elements is used to locally control the amount of light that is transmitted through the display. The local dimming elements can be formed from liquid crystal display structures, polymer-dispersed liquid crystal display structures, photovoltaic material, electrowetting display structures, and/or other suitable light controlling elements. Each local dimming element controls the amount of light that is transmitted through an overlapping region of the array of display pixels. The local dimming elements may be arranged in a uniform array having rows and columns or may be shaped and sized differently and located in specific regions of the display.

Abstract: An electronic device may have a housing. Components such as keys may be mounted in openings in the housing. The housing may include a display housing portion and a base portion that are coupled using hinge structures. The keys may be used to form a keyboard in the base portion of the housing. Sensitive circuitry such as sensitive wireless circuitry may be shielded from electromagnetic interference by shielding the openings with a layer of conductive material. The layer of conductive material may be a metal layer that forms part of a reflector for a backlight structure. The backlight structure may be used to provide backlight for keys in the keyboard. The keyboard may include a support structure having openings through which the backlight passes to reach the keys. The openings may be bridged using conductive paths so that the support structure serves as a radio-frequency shielding structure.

Abstract: An adhesive stack comprises a shear layer positioned between two adhesive layers. The shear layer, comprised of a weak adhesive sub-layer positioned between substrate sub-layers, is designed to fail upon application of a deliberate and appropriate shear force and before the failure of the adhesive layers. The adhesive sub-layer defines a width and/or length less than a width and/or length of another layer or sub-layer of the adhesive stack. The adhesive stack aids in securing components within an electronic device to prevent movement of the component when the device is dropped, hit, or bumped. The adhesive stack may occupy minimal space within the device, and reduce the cost of securing the component within the device's interior. The adhesive stack may allow for replacement of the component by an authorized person applying an appropriate and deliberate force. The adhesive stack may aid in identifying components replaced by an unauthorized person.

Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Abstract: One or more air deflection assemblies are used to redirect air emitted by computers in a rack-based computer system. These air deflection assemblies may be used to redirect air emerging horizontally out of the back sides of computers into a vertically-oriented exhaust plenum. This can eliminate the need for exhaust fans to draw heated air through the exhaust plenums and out of the rack.

Abstract: One or more air deflection assemblies are used to redirect air emitted by computers in a rack-based computer system. These air deflection assemblies may be used to redirect air emerging horizontally out of the back sides of computers into a vertically-oriented exhaust plenum. This can eliminate the need for exhaust fans to draw heated air through the exhaust plenums and out of the rack.

Abstract: A computer system having a fan assembly is provided. In one example, the computer system includes a computer chassis for mounting with a computer rack, the computer chassis comprising a front portion and a rear portion and including a main board. The computer system further includes a fan assembly positioned adjacent to a rear portion of the computer chassis, the fan assembly configured to draw air through the computer toward the rear portion of the computer chassis along a first direction and to expel the air in a second airflow direction non-parallel with the first direction.

Abstract: A cluster module for holding multiple computers. In one variation, a computer rack is configured to receive a plurality of cluster modules, and each of the cluster modules holds a plurality of computers. In one implementation, the computers are secured within the each of the cluster modules in a vertical orientation. In another implementation, the computers are secured within each of the cluster modules in a horizontal orientation.

Abstract: A rack mounted computer system. In one variation the computer rack is configured for side-by-side placement of computers. In another variation, the computer rack includes flanges for supporting the placement of computer units within the rack. In another variation the computer rack is configured with retaining clips. In yet another variation, the computer rack is configured to receive computers with chassis that are adapted for side-by-side placement.

Abstract: A computer system is provided, including: a computer chassis configured to retain a motherboard having a plurality of I/O (input/output) connectors mounted thereon; and an electrically conductive door movable from an open position to a closed position, wherein when said door is in the open position, the I/O connectors are exposed, and when said door is in the closed position, the I/O connectors are covered. A method of operating a computer including a motherboard having a plurality of I/O (input/output) connectors mounted thereon is provided. The method includes operating the computer to generate electromagnetic signals, and blocking the electromagnetic signals with an electrically conductive door movable from an open position to a closed position, wherein when said door is in the open position, the I/O connectors are exposed, and when said door is in the closed position, the I/O connectors are covered.

Abstract: An adaptable power supply for a computer system is provided, including: a power supply case, a power adapter, an input power connector, and a plurality of output connectors fixably mounted to the power supply case, and clustered into at least two clusters for connection to computer system components or subsystems via individual power cables. A method of manufacturing a computer system is also described, including: providing an adaptable power supply having output connectors, and connecting a plurality of computer system components to the power supply output connectors using individual cables. A computer system containing an adaptable power supply is also described.

Abstract: A containment structure for radially deployable devices in the form of a self-coiling composite band. The composite band is fabricated as a lay up of epoxy resin-impregnated ply layers of cloth material that are wrapped about a mandrel and cured in a specific ordered sequence. The ordered sequence of fabrication steps of applying and curing the resin-impregnated cloth layers to the mandrel provides a desired separation of the cured ply layers of the final composite so that they are located at the outer most regions of the composite and are separated by an intermediate resin layer of desired thickness. This ensures a composite band which is effective to function as a negator-spring or composite clock spring and which also exhibits a good combination of mechanical properties, such as elastic modulus, strength, and resilience. In use, the self-coiling composite band is applied about the periphery of a central hub of a radially deployable device by wrapping it therearound in a reverse curl orientation.