Abstract: A system for generating a tunable X-ray pulse comprises a first electron beam source configured to direct a first electron pulse of predetermined energy and pulse length towards a first interaction zone, a laser beam source configured to direct a first photon pulse of predetermined energy and pulse length towards the first interaction zone to interact with the first electron pulse. The first interaction produces a substantially monochromatic second photon pulse of higher photon energy directed towards a second interaction zone, and a second electron beam source configured to direct a second electron pulse of predetermined energy and pulse length towards the second interaction zone so that the second interaction produces an X-ray pulse of predetermined energy and pulse length in a cascaded inverse Compton scattering (ICS) configuration.

Abstract: A magnetic resonance (MR) system and method for generating information about an object is provided. The MR system comprises at least one MR detector configured to sense a plurality of electromagnetic signals and a modulator coupled to the MR detector and configured to modulate optical signals with the electromagnetic signals to generate corresponding modulated optical signals. The MR system further comprises a resonant matching circuit configured for matching an impedance of the MR detector to an impedance of the modulator to achieve at least one of a voltage gain or a noise performance. An optical conduit coupled to the modulator is configured to transmit the modulated optical signals from within a shielded environment to outside the shielded environment. A signal detector coupled to the optical conduit is configured to convert the modulated optical signals to electrical signals.

Abstract: A micro piezo-optic composite transducer comprises: dielectric material; electrodes situated over opposing surfaces of the dielectric material; an optical fiber embedded in the dielectric material, the optical fiber configured to have a wavelength response as a function of material strain; and piezoelectric fibers embedded in the dielectric material and situated on opposing sides of the optical fiber.

Abstract: An electromagnetic coupler comprising: a coupling waveguide adapted for receiving input modes along an input axis, propagating coupling modes along a coupling axis, and transmitting output modes along an output axis, the output axis being not parallel to the coupling axis; and an output waveguide disposed adjacent the coupling waveguide and adapted for receiving the output modes.

Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.

Abstract: A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.

Abstract: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

Abstract: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.

Abstract: A two-stage valve for controlling the flow of gas from a pressurized gas supply with an upper main body including a cavity; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A secondary flow path exists from the pressurized gas supply through the lower main body, through the upper main body, and terminating in the cavity in the upper main body. A first valve is installed in the secondary flow path to open and close the flow of gas from the pressurized gas supply to the cavity. A second valve installed in an exhaust passage in the upper main body allows the pressure in the cavity to exhaust to the environment. When the second valve is closed, the pressure in the cavity in the upper main body can be increased to lower the pre-stressed diaphragm.

Abstract: An optical coupler comprises a fiber optic prism (FOP) comprising first, second, and third side surfaces, the FOP being adapted to receive light through the first side surface, reflect the received light from the third side surface, and transmit the reflected light through the second side surface. The FOP may be used in an optical coupling arrangement comprising a substrate including a light element and a wave guide overlying the substrate, with the optical being situated such that one of the first and second side surfaces is adjacent the light element and the other of the first and second side surfaces is adjacent the wave guide.

Abstract: A two-stage valve for controlling the flow of gas from a pressurized gas supply with an upper main body including a cavity; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A secondary flow path exists from the pressurized gas supply through the lower main body, through the upper main body, and terminating in the cavity in the upper main body. A first valve is installed in the secondary flow path to open and close the flow of gas from the pressurized gas supply to the cavity. A second valve installed in an exhaust passage in the upper main body allows the pressure in the cavity to exhaust to the environment. When the second valve is closed, the pressure in the cavity in the upper main body can be increased to lower the pre-stressed diaphragm.

Abstract: An optical coupler comprises a fiber optic prism (FOP) comprising first, second, and third side surfaces, the FOP being adapted to receive light through the first side surface, reflect the received light from the third side surface, and transmit the reflected light through the second side surface. The FOP may be used in an optical coupling arrangement comprising a substrate including a light element and a wave guide overlying the substrate, with the optical being situated such that one of the first and second side surfaces is adjacent the light element and the other of the first and second side surfaces is adjacent the wave guide.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.