Patents by Inventor Matthew Cummins

Matthew Cummins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220079559
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 17, 2022
    Applicants: University of Southern California, The Regents of the University of California
    Inventors: Robert G. Wodnicki, Qifa Zhou, Thomas Matthew Cummins, Douglas N. Stephens, Katherine W. Ferrara
  • Patent number: 11134918
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Grant
    Filed: February 18, 2017
    Date of Patent: October 5, 2021
    Assignees: University of Southern California, The Regents of the University of California
    Inventors: Robert G. Wodnicki, Qifa Zhou, Thomas Matthew Cummins, Douglas N. Stephens, Katherine W. Ferrara
  • Publication number: 20200046320
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Application
    Filed: February 18, 2017
    Publication date: February 13, 2020
    Applicants: University of Southern California, Regents of the University of California, Daavis
    Inventors: Robert G. WODNICKI, Qifa ZHOU, Thomas Matthew CUMMINS, Douglas N. STEPHENS, Katherine W. FERRARA
  • Publication number: 20050109738
    Abstract: A series of replacement parts for use in a plasma arc torch is provided, wherein the parts have a color indicia and are adapted for use at different operating parameter values. Each part in the series has a color indicia formed on the part with a different color identifying the particular value of the operating parameter at which the part is adapted to operate. In another form, each part in the series is packaged in a package with a different color indicia identifying the particular value of the operating parameter at which the part is adapted to operate. Additionally, methods of packaging, applying the color indicia, selecting a package or part, and specifying a package or part are provided by the present invention.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Roger Hewett, Robert Brown, Matthew Cummins, Kevin Horner-Richardson