Abstract: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate copolymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or increased molecular weights. The crosslinked compositions can function as adhesive compositions that are particularly well suited for use in electronic devices.

Abstract: A system includes a plurality of thermostats corresponding to a plurality of HVAC systems that serve a plurality of spaces and a computing system communicable with the plurality of thermostats via a network. The computing system is configured to, for each space of the plurality of spaces, obtain a set of training data relating to thermal behavior of the space, identify a model of thermal behavior of the space based on the set of training data, perform a model predictive control process using the model of thermal behavior of the space to obtain a temperature setpoint for the space, and provide the temperature setpoint to the thermostat corresponding to the HVAC system serving the space. The plurality of thermostats are configured to control the plurality of HVAC systems in accordance with the temperature setpoints.

Abstract: A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents.

Abstract: A method including, in one embodiment, severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB), capturing the substrate sample by activating a grasping element, and separating the captured sample from the substrate. The captured sample may be separated from the substrate and transported to an electron microscope for examination.

Abstract: A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.

Abstract: A system and method for storing potential energy in a microcomponent is disclosed comprising a multi-stable element having two or more equilibrium states and a stopper to restrict the multi-stable element from entering at least one of the two or more equilibrium states. The pre-charged microcomponent may then preferably be transported to another location and use the stored potential energy to perform some action.

Abstract: A system and method is disclosed that strengthens the structural integrity of trench-fill electrical isolation techniques. One embodiment provides for etching a series of interlocking geometric trenches into a device layer and filling the trenches with a non-conductive dielectric material. The dielectric material establishes electrical isolation while the interlocking geometric trenches strengthen the structural integrity of the separation by providing at least one surface on the interlocking separation that experiences a compression force for each direction that the electrically isolated MEMS component is moved.

Abstract: A deflection element operating under control of selectively applied energy is used to achieve low insertion loss between mating elements. Once the elements are in proper relationship the deflection element is allowed to settle to its stable position thereby serving to lock the elements together.

Abstract: In one embodiment, the present invention is directed to a system that enables controllable positioning of a fully-released micro-stage. The fully-released micro-stage may be assembled onto a detector substrate that enables micro-positioning feedback. A payload structure (e.g., a lens, mirror, manipulator, and/or the like) may be assembled or coupled onto the fully-release microstage. Snap connectors may facilitate the mechanical coupling associated with assembly of the various components. The fully-released microstage may be actuated by motion amplified actuators that are coupled to anchored flexures. Moreover, the actuation of the fully-release microstage may produce fully decoupled movement by coupling the actuators and respective flexures to the stage in a mirrored fashion.

Abstract: In a microactuator having substantially parallel beams, the free ends of the beams are detached from the substrate and rigidly interconnected with one another. Differential thermal expansion of the beams causes deflection of the free ends as a unit laterally away from the thermally expanded beam. Depending on the choice of thermally expanded beam, the deflection can be either in or out of the plane parallel to the substrate. Selective heating is achieved for example by passing electric current through a pair of beams in series. Each beam has an independent electrical contact pad at the base end, and all beams are connected together electrically at the free end. A voltage is applied across the selected beam pads, whereas the non-selected beam pads are disconnected. Multiple microactuators can be combined cooperatively, e.g., to move a stage in a plurality of directions.

Abstract: A system and method are disclosed that enable precise positioning of microcomponents. According to one embodiment, a system and method for positioning a microcomponent are disclosed, wherein a microcomponent is received into a microcomponent positioning device. A target position for the microcomponent may then be determined, and at least a portion of the microcomponent positioning device is controllably deformed to accurately fix, at least temporarily, the position of the microcomponent at the target position. In one embodiment, microactuators that are operable to move the microcomponent are controllably deformed to fix the position of the microcomponent at the target position. In another embodiment, support beams that support a microcomponent holder are controllably deformed to fix the position of the microcomponent at the target position.

Abstract: A system, apparatus, and method which enable microcomponents to be electrically coupled in a desirable manner are disclosed. More specifically, electrical coupling mechanisms are disclosed, which are suitable for providing an electrical coupling between two or more microcomponents. One electrical coupling mechanism provided herein, which may be utilized to provide a flexible coupling between two or more microcomponents, is a ribbon cable. Such a ribbon cable may include one or more electrically isolated conducting “rows,” which may enable communication of electrical signals between two or more microcomponents coupled to such ribbon cable. An electrical connector, such as an electrical snap connector, is also provided herein, which is suitable for electrically coupling two or more microcomponents.

Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent.

Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents.

Abstract: A system and method are disclosed that enable precise positioning of microcomponents. According to one embodiment, a system and method for positioning a microcomponent are disclosed, wherein a microcomponent is received into a microcomponent positioning device. A target position for the microcomponent may then be determined, and at least a portion of the microcomponent positioning device is controllably deformed to accurately fix, at least temporarily, the position of the microcomponent at the target position. In one embodiment, microactuators that are operable to move the microcomponent are controllably deformed to fix the position of the microcomponent at the target position. In another embodiment, support beams that support a microcomponent holder are controllably deformed to fix the position of the microcomponent at the target position.

Abstract: A system and method are disclosed that provide a microgripper having a linearly actuated grasping mechanism. According to one embodiment, a microgripper comprises at least one grasping mechanism. The microgripper further comprises at least one linear microactuator mechanism operable to impart linear movement to the grasping mechanism(s). In certain implementations, the grasping mechanism(s) comprise two arms that are arranged substantially parallel to each other. Further, in certain implementations the linear microactuator mechanism comprises a linear stepper actuator. Such linear microactuator mechanism is preferably coupled to the arms such that actuation of the linear microactuator mechanism imparts linear movement to the arms.

Abstract: A system and method which provide a general-purpose pressure-fitting receptacle (or “clamp”) suitable for coupling microcomponents are disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure fit with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a “preloaded” receptacle that may be utilized to perform general assembly of microcomponents.