Abstract: A microfluidic chip is disclosed herein. In an embodiment, the microfluidic chip includes a body including at least one microfluidic pathway configured to receive a fluid sample, the at least one microfluidic pathway including a coating configured to reduce fluid diffusion and seal a surface of the at least one microfluidic pathway, and a heating device located on the body and forming a heating zone within a portion of the at least one microfluidic pathway.

Abstract: A microfluidic chip is disclosed herein. In an embodiment, the microfluidic chip includes a body including at least one microfluidic pathway configured to receive a fluid sample, the at least one microfluidic pathway including a coating configured to reduce fluid diffusion and seal a surface of the at least one microfluidic pathway, and a heating device located on the body and forming a heating zone within a portion of the at least one microfluidic pathway.

Abstract: A microfluidic chip for a microfluidic system includes a PDMS substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an UV curable epoxy adhesive, a gel epoxy or epoxy under trade name of EPO-TEK OG175, MasterBond EP30LV-1 or Locite 0151.

Abstract: A microfluidic chip for a microfluidic system includes a PDMS substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an UV curable epoxy adhesive, a gel epoxy or epoxy under trade name of EPO-TEK OG175, MasterBond EP30LV-1 or Locite 0151.

Abstract: A microfluidic chip for a microfluidic system includes a PDMS substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an UV curable epoxy adhesive, a gel epoxy or epoxy under trade name of EPO-TEK OG175, MasterBond EP30LV-1 or Locite 0151.

Abstract: A microfluidic chip includes a thin biaxially-oriented polyethylene terephthalate (“BoPET”) film and a micro-channel in the BoPET film. A method for manufacturing a microfluidic chip includes coating UV epoxy on a first side of a BoPET film, placing the BoPET film on a first substrate with the first side facing the first substrate, curing the UV epoxy on the first side of the BoPET film to attach the BoPET film on the first substrate; forming at least one microfluidic pathway in the BoPET film, coating UV epoxy on a first side of a second substrate, placing the second substrate on the BoPET film with the first side of the second substrate facing a second side of the BoPET film, and curing the UV epoxy on the first side of the second substrate to attach the BoPET film to the second substrate. The microfluidic chip may be a multi-layered chip.

Abstract: A microfluidic chip for a microfluidic system includes a micro-to-macro seal. The microfluidic chip has a substrate, at least one microfluidic pathway in the substrate, and a PDMS seal layer on the substrate and above the microfluidic pathway. The PDMS seal layer provides a seal above the microfluidic pathway and prevent particles or contaminants entering the micro-channel during transportation or prior to application. During application, a needle or piping pierces through the PDMS seal layer, and fluid can be pumped into the microfluidic chip without concern for the fluid leaking despite high pressure required to pump or drive the fluid into the microfluidic pathway.

Abstract: A microfluidic chip includes a thin biaxially-oriented polyethylene terephthalate (“BoPET”) film and a micro-channel in the BoPET film. A method for manufacturing a microfluidic chip includes coating UV epoxy on a first side of a BoPET film, placing the BoPET film on a first substrate with the first side facing the first substrate, curing the UV epoxy on the first side of the BoPET film to attach the BoPET film on the first substrate; forming at least one microfluidic pathway in the BoPET film, coating UV epoxy on a first side of a second substrate, placing the second substrate on the BoPET film with the first side of the second substrate facing a second side of the BoPET film, and curing the UV epoxy on the first side of the second substrate to attach the BoPET film to the second substrate. The microfluidic chip may be a multi-layered chip.

Abstract: A microfluidic chip for a microfluidic system includes a PDMS substrate having a first thickness, at least one microfluidic pathway in the substrate, a coating along the microfluidic pathway, and a glass layer having a second thickness on the substrate and above the microfluidic pathway, wherein the coating contains an optically transparent material, and the first thickness is greater than the second thickness. The coating includes cyanoacrylates, an UV curable epoxy adhesive, a gel epoxy or epoxy under trade name of EPO-TEK 0G175, MasterBond EP30LV-1 or Locite 0151.