Patents by Inventor Matthew D. Shaw

Matthew D. Shaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11864472
    Abstract: A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: January 2, 2024
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Harold Frank Greer, Andrew D. Beyer, Matthew D. Shaw, Daniel P. Cunnane
  • Publication number: 20220291142
    Abstract: Methods, systems, and devices for testing an electro-optic device such as a modulator or a switch are disclosed.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 15, 2022
    Inventors: Shayan Mookherjea, Xiaoxi Wang, Boris A. Korzh, Matthew D. Shaw
  • Publication number: 20220013706
    Abstract: A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.
    Type: Application
    Filed: July 12, 2021
    Publication date: January 13, 2022
    Applicant: California Institute of Technology
    Inventors: Harold Frank Greer, Andrew D. Beyer, Matthew D. Shaw, Daniel P. Cunnane