Patents by Inventor Matthew Doyle

Matthew Doyle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12284796
    Abstract: A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 22, 2025
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Eric J. Campbell, Stuart Brett Benefield, Matthew Doyle, Matteo Cocchini
  • Patent number: 12258020
    Abstract: A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 25, 2025
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, John R. Dangler, Layne A. Berge, Jason J. Bjorgaard, Matthew A. Walther, Kyle Schoneck, Thomas W. Liang
  • Patent number: 12207392
    Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: January 21, 2025
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, David Clifford Long, Matteo Cocchini, Russell A. Budd, James Busby, Roger S. Krabbenhoft, Arthur J. Higby
  • Patent number: 12194575
    Abstract: A portable welder that includes a portable housing, a ground clamp, an electrode holder, a user interface, and a battery pack interface. The ground clamp is connected to the portable housing through a ground cable and is configured to be connected to a metal workpiece. The electrode holder is connected to the portable housing through an electrode cable. The electrode holder includes a mount connected to the electrode cable and a user input. The mount is configured to hold a consumable electrode. The user input is configured to activate the portable welder. The user interface located on the housing. The battery pack interface is configured to receive a removable and rechargeable battery pack.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: January 14, 2025
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Woodrow W. Walker, Andrew D. Van Hoorn, Matthew Doyle, Timothy J. Bartlett, Timothy R. Obermann, Steven C. Zbrozek
  • Publication number: 20240426893
    Abstract: Computer-implemented methods for performing enhanced resolution time-domain reflectometry are provided. Aspects include obtaining a plurality of waveforms by transmitting a first pulse on a transmission line, transmitting a second pulse on the transmission line, where the second pulse is transmitted after the first pulse by a delay, and capturing and measuring reflections of the transmitted pulses, wherein the delay corresponding to each of the plurality of waveforms is different. Aspects also include identifying a discontinuity of the transmission line based at least in part on the plurality of waveforms. Based on a determination that the transmission line includes the discontinuity, aspects include calculating third derivative curves for each of the plurality of waveforms and calculating a length of the discontinuity of the transmission line based on the third derivative curves. Aspects also include creating a notification indicating a location and the length of the discontinuity of the transmission line.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Inventors: Samuel R. Conner, Matteo Cocchini, Matthew Doyle, Stuart Brett Benefield
  • Publication number: 20240426608
    Abstract: A level includes a frame having a top planar surface, a bottom planar surface, and a web coupling the top planar surface to the bottom planar surface. The top planar surface and the bottom planar surface are parallel. The level further includes a vial supported by the frame. The vial has a longitudinal axis passing through a center of the vial and a body defining an interior containing a liquid and an indicator bubble. The level further includes a plurality of LEDs. Each of the LEDs has a light emitting point, and each of the plurality of LEDs is positioned adjacent an end of the vial and is oriented such that the light emitting point is positioned within the interior of the body of the vial.
    Type: Application
    Filed: June 27, 2024
    Publication date: December 26, 2024
    Inventors: Roger D. Neitzell, Richard J. LaSota, Thomas P. Foran, Matthew Doyle, Christopher Frederick Boehme, Matthew Leidel
  • Patent number: 12174240
    Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: December 24, 2024
    Assignee: International Business Machines Corporation
    Inventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler
  • Patent number: 12174241
    Abstract: An apparatus for tin whisker isolation and detection includes a substrate having a plurality of pads for connecting to an electronic component placed on the substrate, and a shield placed on a surface of the substrate. The shield includes a plurality of cavities aligned over the plurality of pads. A plurality of sensing components each associated with one of the plurality of cavities are configured for sensing an electrically conductive growth from a corresponding pad of the plurality of pads. A plurality of circuit connections are each configured to connect one of the sensing components to detection circuitry. The detection circuitry is configured to receive one or more sensing signals from one or more of the sensing components and detect an electrically conductive growth from the corresponding pad based on the one or more sensing signals.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: December 24, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthew Doyle, Jeffrey N. Judd, Mark J. Jeanson, Timothy J. Tofil, Matthew S. Kelly, Henry Michael Newshutz
  • Patent number: 12148276
    Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: November 19, 2024
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, Jeffrey N. Judd, Timothy J. Tofil, Matteo Cocchini, Stuart Brett Benefield, Samuel R. Connor, Andrew Corbett
  • Patent number: 12117420
    Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: October 15, 2024
    Assignee: International Business Machines Corporation
    Inventors: Layne A. Berge, Matthew Doyle, John R. Dangler, Thomas W. Liang, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
  • Publication number: 20240311222
    Abstract: A method, computer system, and a computer program product for computer memory structural analysis are provided. A processor receives test results that indicate baseline interface voltage level that is from a transient data transmission and is measured at the computer memory. In response to detecting, via the processor, that the test results indicate a baseline wander for the baseline interface voltage level of the computer memory, the processor generates, based on the baseline wander, an identification of an associated structural communication flaw of the computer memory and a compensation recommendation for compensative for the structural flaw. The processor transmits the compensation recommendation for presentation of the compensation recommendation.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 19, 2024
    Inventors: Matthew Doyle, Patrick Fiske, Rodolfo Lopez, Sneha U. Kadam
  • Patent number: 12079377
    Abstract: A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: September 3, 2024
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Matthew Doyle, Mark J. Jeanson, Gerald Bartley, Darryl Becker
  • Patent number: 12075702
    Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: August 27, 2024
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, Joseph Kuczynski, Patrick Egan, Jeffrey N. Judd, Timothy J. Tofil
  • Patent number: 12055415
    Abstract: A level includes a frame having a top planar surface, a bottom planar surface, and a web coupling the top planar surface to the bottom planar surface. The top planar surface and the bottom planar surface are parallel. The level further includes a vial supported by the frame. The vial has a longitudinal axis passing through a center of the vial and a body defining an interior containing a liquid and an indicator bubble. The level further includes a plurality of LEDs. Each of the LEDs has a light emitting point, and each of the plurality of LEDs is positioned adjacent an end of the vial and is oriented such that the light emitting point is positioned within the interior of the body of the vial.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: August 6, 2024
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Roger D. Neitzell, Richard J. LaSota, Thomas P. Foran, Matthew Doyle, Christopher Frederick Boehme, Matthew Leidel
  • Patent number: 12051870
    Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: July 30, 2024
    Assignee: International Business Machines Corporation
    Inventors: Kyle Schoneck, Layne A. Berge, Jason J. Bjorgaard, John R. Dangler, Matthew Doyle, Thomas W. Liang, Matthew A. Walther
  • Publication number: 20240197975
    Abstract: An extracorporeal blood treatment device and a method are provided for removing a secondary membrane formed on a semipermeable membrane of a dialyzer during an extracorporeal blood treatment. The extracorporeal blood treatment device operates in a first operating mode in which a dialysate outlet valve is open such that dialysate flows through a dialyzer feed line, through a dialysate chamber, and into and through a dialyzer discharge line. The extracorporeal blood treatment device operates in a second operating mode to remove the secondary membrane from the semipermeable membrane. During the second operating mode, the dialysate outlet valve is closed for a duration of time such that dialysate is prevented from flowing through the dialyzer discharge line. A backflush procedure results wherein a volume of dialysate passes from the dialysate chamber through the semipermeable membrane and into the blood chamber.
    Type: Application
    Filed: February 27, 2024
    Publication date: June 20, 2024
    Applicant: Fresenius Medical Care Holdings, Inc.
    Inventors: Matthew Doyle, Robert Anthony Zimmerman
  • Publication number: 20240186671
    Abstract: One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Thomas W. Liang, John R. Dangler, Matthew A. Walther, Jason J. Bjorgaard, Trevor Timpane
  • Patent number: 11991277
    Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 21, 2024
    Assignee: International Business Machines Corporation
    Inventors: Arthur J. Higby, David Clifford Long, Edward N. Cohen, John R. Dangler, Matthew Doyle, Philipp K. Buchling Rego, William Santiago-Fernandez, Levi Campbell, James Busby
  • Patent number: 11982543
    Abstract: A level with a removable end cap is provided. The level includes a hollow level body. The end cap includes an outer member and locking member received within the outer member. The locking member is inserted into the outer member pushing a moveable portion of the outer member into a frictional engagement that holds the end cap assembly in place relative to the level body.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: May 14, 2024
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Matthew Doyle, Fraizier Reiland, Lauren Weigel
  • Patent number: 11963307
    Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 16, 2024
    Assignee: International Business Machines Corporation
    Inventors: Matthew Doyle, Thomas W. Liang, Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther