Patents by Inventor Matthew E. Stahley

Matthew E. Stahley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an electronic device package
    Patent number: 8869389
    Abstract: An electronic device package 100 comprising a lead frame 105 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: October 28, 2014
    Assignee: LSI Corporation
    Inventors: Larry Golick, Qwai Hoong Low, John W. Osenbach, Matthew E. Stahley
  • Lead frame design to improve reliability
    Patent number: 8334467
    Abstract: An electronic device package 100 comprising a lead frame 150 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: December 18, 2012
    Assignee: LSI Corporation
    Inventors: Larry W. Golick, Qwai Hoong Low, John W. Osenbach, Matthew E. Stahley
  • LEAD FRAME DESIGN TO IMPROVE RELIABILITY
    Publication number: 20100319987
    Abstract: An electronic device package 100 comprising a lead frame having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.
    Type: Application
    Filed: June 17, 2009
    Publication date: December 23, 2010
    Applicant: LSI Corporation
    Inventors: Larry W. Golick, Qwai Hoong Low, John W. Osenbach, Matthew E. Stahley