Abstract: Disclosed herein are methods, systems, and devices for providing light for surface disinfection. In one embodiment, a device includes a controller, a disinfecting light source electronically coupled with the controller, and a positioning mechanism mechanically coupled with the light source and electronically coupled with the controller. Additionally, the controller is configured to direct the disinfecting light source using the positioning mechanism.

Abstract: Drivable vehicles, such as electric go-karts, for driving in a controlled environment are equipped with a camera, a display, and a processor for controlling images on the display. In one embodiment, the camera and display are in a single smartphone, with the camera lens facing opposite to the display. The smartphone is affixed to a safety helmet, or other headgear, so that the driver can simultaneously view the display screen while seeing the real world using peripheral vision. Overlaid on the displayed real world image is any type of artificial reality image, such as obstacles, robot combatants, simulated vehicles, etc. The AR image may be independently controlled by the smartphone processor and interacts with the driver, such as by reacting to getting shot by the driver or shooting at the driver. The AR image is 3-D rendered so its perspective and size realistically changes as the vehicle is driven.

Abstract: A lateral conduction MOSFET has a trench between and separating surface source and drain electrodes. A gate insulation lines one vertical wall of the trench and a polysilicon gate mass is disposed adjacent the gate insulator and fills a portion of the width of the trench. The conduction path from surface source to surface drain is thus elongated by the periphery of the depth of the trench without using excessive surface area for the MOSFET die.

Abstract: A semiconductor device which includes a power electrode on a surface thereof, a solderable body on the power electrode and a passivation body spaced from but surrounding the solderable body.

Abstract: A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.