Abstract: The present disclosure relates to a microelectronics module featuring thermal interface material (TIM) containment for efficient and reliable top-side cooling, and a process for making the same. The microelectronics module includes a module substrate, a flip-chip die attached to the module substrate, and a heat spreader positioned above and thermally coupled to the flip-chip die. A TIM barrier, partially embedded in a mold compound, continuously surrounds the heat spreader and protrudes vertically beyond the heat spreader to define a TIM cavity over the heat spreader. A TIM section fills the TIM cavity to cover the heat spreader. A heat sink is in contact with both the TIM section and the TIM barrier, where the TIM barrier is configured to prevent the TIM section from shifting away from over the heat spreader, thereby maintaining thermal coupling between the heat sink and the heat spreader through the TIM section.

Abstract: The present disclosure provides a packaging device and a method to form the packaging device. The packaging device includes a package base, a die structure disposed over the package base, and a package lid over the die structure. The package lid is thermally coupled with the die structure and the package base.

Abstract: The disclosure is directed to an electronic package with an interposer between integrated circuit dies. At least one inner capacitor (e.g., single layer capacitor) is mounted to the interposer. The electronic package further includes an input passive circuit substrate and an output passive circuit substrate mechanically coupled to the metal base. Use of an interposer to be simultaneously solder attached with integrated circuit dies provides a configuration that improves linearity performance and/or wide video bandwidth of the electronic package (e.g., packages that use epoxy and laminate interposers). Further, such configuration facilitates efficient manufacturing of the electronic package at high volumes.

Abstract: Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.

Abstract: The present disclosure relates to a semiconductor package with a thermally enhanced molding compound. The disclosed semiconductor package includes a module carrier having an upper surface, a die formed over the upper surface of the module carrier, and a thermally enhanced molding compound component formed over the upper surface of module carrier to encapsulate the die. Herein, the thermally enhanced molding compound is formed from a molding compound mixed with a thermal additive and has no air pockets or voids. The thermal additive includes a number of carbon flakes or a number of carbon spherical particles. The thermal additive has a thermal conductivity larger than 450 W/m·K and an electrical resistivity larger than 90 ??.cm. In one embodiment, the thermal additive includes a number of graphene flakes, a number of graphene particles, a number of graphite flakes, or a number of graphite particles.

Abstract: The disclosure is directed to an electronic package with an interposer between integrated circuit dies. At least one inner capacitor (e.g., single layer capacitor) is mounted to the interposer. The electronic package further includes an input passive circuit substrate and an output passive circuit substrate mechanically coupled to the metal base. Use of an interposer to be simultaneously solder attached with integrated circuit dies provides a configuration that improves linearity performance and/or wide video bandwidth of the electronic package (e.g., packages that use epoxy and laminate interposers). Further, such configuration facilitates efficient manufacturing of the electronic package at high volumes.

Abstract: Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.

Abstract: One embodiment of an integrated circuit includes a substrate, an electrical device positioned above the substrate, and a bond bad positioned above and aligned along a vertical axis with the electrical device such that the electrical device is positioned between the substrate and the bond pad.