Abstract: A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract: The present invention provides an interconnect between layers of a circuit board. A conductive object is embedded in the layer of a circuit board.

Abstract: An automated inspection system particularly adapted for detection and discrimination of surface irregularities of specularly reflecting and other materials, such as are employed in laminate chip carriers and printed circuit boards, includes an area scan image sensor allowing illumination sources to surround an area of a surface being inspected. The illumination source preferably provides either or both bright field and dark field illumination of the surface; developing generally complementary images of surface irregularities. A self-registering rules-driven process for developing inspection masks reduces alignment operations and improves performance. Image enhancement and morphological operations to detect surface irregularities are performed by digital signal processing, preferably using a dedicated vision processor. Masks screen potential defects to critical mounting and bonding surfaces accurately without requiring alignment of data or reference images to acquired images.

Abstract: The accuracy of a capacitive testing procedure is improved by adjusting the ideal values against which comparisons are made during the testing process, for all of the circuit elements (e.g., pin connections) being tested, responsive to cumulative deviations of the measured values from their anticipated ideal values. This can be accomplished by initially comparing all of the capacitance measurements taken for a given printed circuit to their ideal values, and calculating a deviation for each of the comparisons made. Following the testing of an entire printed circuit, the resulting series of calculated deviations are tabulated and averaged, and the resulting average deviation is then added to or subtracted from the tabulated readings for each of the circuit elements before any true defects are identified for the printed circuit being tested. In this way, all of the parts being tested are brought to the same baseline, eliminating overall reference differences (i.e., between different panels).

Abstract: A high speed shunt regulator comprises a DC current source, a DC voltage reference/current shunt circuit, and first and second Schottky diodes connected in series with each other between the DC current source and the DC voltage reference/current shunt circuit. An output port for the load is connected between the first and second Schottky diodes. The Schottky diodes have little parasitic capacitance and virtually no reverse recovery. Consequently, the amount of current passing through the Schottky diodes can change in one nanosecond and the shunt regulator can accommodate high frequency fluctuations in the load while maintaining rated voltage. In other words, the Schottky diodes serve the function of "isolating" the slower semiconductors of the DC current source and reference voltage/current shunt circuit from the load.