Patents by Inventor Matthew Feurtado

Matthew Feurtado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power multilayer module having low inductance and fast switching for paralleling power devices
    Patent number: 11696417
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: July 4, 2023
    Assignee: WOLFSPEED, INC.
    Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
  • HIGH POWER MULTILAYER MODULE HAVING LOW INDUCTANCE AND FAST SWITCHING FOR PARALLELING POWER DEVICES
    Publication number: 20220354014
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Application
    Filed: July 7, 2022
    Publication date: November 3, 2022
    Inventors: Matthew FEURTADO, Brice MCPHERSON, Daniel MARTIN, Alexander LOSTETTER
  • High power multilayer module having low inductance and fast switching for paralleling power devices
    Patent number: 11445630
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: September 13, 2022
    Assignee: WOLFSPEED, INC.
    Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
  • HIGH POWER MULTILAYER MODULE HAVING LOW INDUCTANCE AND FAST SWITCHING FOR PARALLELING POWER DEVICES
    Publication number: 20210136947
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 6, 2021
    Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
  • High power multilayer module having low inductance and fast switching for paralleling power devices
    Patent number: 10917992
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: February 9, 2021
    Assignee: CREE FAYETTEVILLE, INC.
    Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
  • High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
    Publication number: 20200053900
    Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
  • Power module having pin fins
    Patent number: D942403
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: February 1, 2022
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Matthew Feurtado
  • Housing for a power module assembly
    Patent number: D954668
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 14, 2022
    Assignee: WOLFSPEED, INC.
    Inventors: Matthew Feurtado, Daniel Martin, Ty McNutt, Brice McPherson, Alexander Lostetter
  • Power module having pin fins
    Patent number: D985517
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: May 9, 2023
    Assignee: WOLFSPEED, INC
    Inventors: Brice McPherson, Matthew Feurtado
  • Power module having pin fins
    Patent number: D1041429
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 10, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Brice McPherson, Matthew Feurtado