Patents by Inventor Matthew G. Bausch

Matthew G. Bausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of localized hardening of dicing channel by applying localized heat in wafer kerf
    Patent number: 9209082
    Abstract: Various embodiments include localized hardening of dicing channels in an integrated circuit (IC) wafer. In some embodiments, a method includes: applying localized heat to a metal interconnect in a wafer kerf on an IC wafer using a heat source; and removing the heat source to cool the metal interconnect after the applying of the localized heat to the metal interconnect, wherein the applying of the heat and the removing of the heat source increases a hardness of the metal interconnect.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: December 8, 2015
    Assignee: International Business Machines Corporation
    Inventors: Matthew G. Bausch, Eric D. Marz, Benjamin J. Pierce, Jared P. Yanofsky
  • METHODS OF LOCALIZED HARDENING OF DICING CHANNEL
    Publication number: 20150194346
    Abstract: Various embodiments include localized hardening of dicing channels in an integrated circuit (IC) wafer. In some embodiments, a method includes: applying localized heat to a metal interconnect in a wafer kerf on an IC wafer using a heat source; and removing the heat source to cool the metal interconnect after the applying of the localized heat to the metal interconnect, wherein the applying of the heat and the removing of the heat source increases a hardness of the metal interconnect.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 9, 2015
    Applicant: International Business Machines Corporation
    Inventors: Matthew G. Bausch, Eric D. Marz, Benjamin J. Pierce, Jared P. Yanofsky