Patents by Inventor Matthew Gen

Matthew Gen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device cooling
    Patent number: 11829214
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: November 28, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung Yang, Matthew Gen, Todd Chiles
  • Device Cooling
    Publication number: 20230324965
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung YANG, Matthew GEN, Todd CHILES
  • Shared cooling for thermally connected components in electronic devices
    Patent number: 10175731
    Abstract: Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: January 8, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chau Van Ho, Bo Dan, Spencer Eggert, Greg Nielsen, Matthew Gen
  • SHARED COOLING FOR THERMALLY CONNECTED COMPONENTS IN ELECTRONIC DEVICES
    Publication number: 20170364130
    Abstract: Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 21, 2017
    Inventors: Chau Van Ho, Bo Dan, Spencer Eggert, Greg Nielsen, Matthew Gen