Patents by Inventor Matthew Gwinn
Matthew Gwinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11915906Abstract: A method of scanning a wafer includes placing the wafer over a substrate holder inside a processing chamber, where the wafer is placed at a first twist angle relative to a reference axis of a rotatable feedthrough of the processing chamber. The method further includes performing a first pass scan by exposing the wafer to an ion beam while driving two rotary drives disposed in a scanning chamber synchronously to generate a planar motion of the wafer from a rotational motion of the two rotary drives, where the wafer is oriented continuously at the first twist angle when performing the first pass scan.Type: GrantFiled: February 2, 2023Date of Patent: February 27, 2024Assignee: TEL Manufacturing and Engineering of America, Inc.Inventors: Matthew Gwinn, Paul Consoli, Jerry Negrotti
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Patent number: 11715620Abstract: A method for processing a substrate that includes: applying, at an ionizer, a drive pulse train to an ion source to ionize a gas cluster beam and transfer the drive pulse train to the gas cluster beam; measuring, at a detector exposed to the gas cluster beam, a beam current synchronously with the drive pulse train; obtaining time-of-flight information of the clusters and the monomers in the gas cluster beam based on the beam current and the drive pulse train; determining size information relating to a size distribution of clusters and monomers in the gas cluster ion beam based on the time-of-flight information; adjusting a process parameter of the gas cluster beam based on the size information; and exposing the substrate to the gas cluster beam with the adjusted process parameter.Type: GrantFiled: October 4, 2021Date of Patent: August 1, 2023Assignee: TEL Manufacturing and Engineering of America, Inc.Inventors: Matthew Gwinn, Martin Tabat, Kenneth Regan
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Patent number: 11694872Abstract: A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.Type: GrantFiled: May 17, 2022Date of Patent: July 4, 2023Assignee: TEL Manufacturing and Engineering of America, Inc.Inventors: Kazuya Dobashi, Hiromitsu Kambara, Masaru Nishino, Reo Kosaka, Matthew Gwinn, Luis Fernandez, Kenichi Oyama, Sakurako Natori, Noriaki Okabe
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Publication number: 20230187168Abstract: A method of scanning a wafer includes placing the wafer over a substrate holder inside a processing chamber, where the wafer is placed at a first twist angle relative to a reference axis of a rotatable feedthrough of the processing chamber. The method further includes performing a first pass scan by exposing the wafer to an ion beam while driving two rotary drives disposed in a scanning chamber synchronously to generate a planar motion of the wafer from a rotational motion of the two rotary drives, where the wafer is oriented continuously at the first twist angle when performing the first pass scan.Type: ApplicationFiled: February 2, 2023Publication date: June 15, 2023Inventors: Matthew Gwinn, Paul Consoli, Jerry Negrotti
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Patent number: 11587760Abstract: A scanning system includes a scanning chamber; a first rotary drive disposed in the scanning chamber and configured to rotate around a first axis; a second rotary drive disposed in the scanning chamber and configured to rotate around the first axis synchronously with the first rotary drive; and a bar-and-hinge system disposed in the scanning chamber and mechanically coupled to a substrate holder, the hinge system configured to translate a rotary motion of the first rotary drive and the second rotary drive to a planar motion of the substrate holder.Type: GrantFiled: October 14, 2020Date of Patent: February 21, 2023Assignee: TEL Manufacturing and Engineering of America, Inc.Inventors: Matthew Gwinn, Paul Consoli, Jerry Negrotti
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Publication number: 20230021625Abstract: A method of scanning a substrate includes immobilizing a substrate on a substrate holder within a processing chamber and performing a pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive to move the substrate relative to a processing apparatus focused on a localized spot on the substrate, the first rotary drive being coupled to a proximal end of a pendulum arm and the second rotary drive being mounted at a distal end of the pendulum arm and to the substrate holder. Driving the first rotary drive during the pass includes moving the pendulum arm in a first arc motion for a first portion of the pass while the localized spot is on the substrate, and then moving the pendulum arm in an opposite second arc motion for a second portion of the pass while the localized spot is on the substrate.Type: ApplicationFiled: July 21, 2021Publication date: January 26, 2023Inventors: Kevin Siefering, Michael Gruenhagen, Matthew Gwinn
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Publication number: 20220359155Abstract: A method for processing a substrate that includes: applying, at an ionizer, a drive pulse train to an ion source to ionize a gas cluster beam and transfer the drive pulse train to the gas cluster beam; measuring, at a detector exposed to the gas cluster beam, a beam current synchronously with the drive pulse train; obtaining time-of-flight information of the clusters and the monomers in the gas cluster beam based on the beam current and the drive pulse train; determining size information relating to a size distribution of clusters and monomers in the gas cluster ion beam based on the time-of-flight information; adjusting a process parameter of the gas cluster beam based on the size information; and exposing the substrate to the gas cluster beam with the adjusted process parameter.Type: ApplicationFiled: October 4, 2021Publication date: November 10, 2022Inventors: Matthew Gwinn, Martin Tabat, Kenneth Regan
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Publication number: 20220351997Abstract: A method including: collecting first processing tool machine data from a first processing tool while treating semiconductor substrates, the first processing tool machine data including process data and operational codes associated with one or more discrete intervals of time during the treatments, training a first neural network with the first processing tool machine data from the first processing tool, and generating a first output indicative of a fault of the first processing tool from the first neural network, based, at least in part, on applying subsequent machine data from at least one processing tool.Type: ApplicationFiled: November 10, 2021Publication date: November 3, 2022Inventor: Matthew Gwinn
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Patent number: 11450506Abstract: A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.Type: GrantFiled: September 11, 2020Date of Patent: September 20, 2022Assignee: TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.Inventors: Kazuya Dobashi, Hiromitsu Kambara, Masaru Nishino, Reo Kosaka, Matthew Gwinn, Luis Fernandez, Kenichi Oyama, Sakurako Natori, Noriaki Okabe
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Publication number: 20220277924Abstract: A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Inventors: Kazuya Dobashi, Hiromitsu Kambara, Masaru Nishino, Reo Kosaka, Matthew Gwinn, Luis Fernandez, Kenichi Oyama, Sakurako Natori, Noriaki Okabe
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Publication number: 20210335568Abstract: A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.Type: ApplicationFiled: September 11, 2020Publication date: October 28, 2021Inventors: Kazuya Dobashi, Hiromitsu Kambara, Masaru Nishino, Reo Kosaka, Matthew Gwinn, Luis Fernandez, Kenichi Oyama, Sakurako Natori, Noriaki Okabe
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Publication number: 20210335642Abstract: A scanning system includes a scanning chamber; a first rotary drive disposed in the scanning chamber and configured to rotate around a first axis; a second rotary drive disposed in the scanning chamber and configured to rotate around the first axis synchronously with the first rotary drive; and a bar-and-hinge system disposed in the scanning chamber and mechanically coupled to a substrate holder, the hinge system configured to translate a rotary motion of the first rotary drive and the second rotary drive to a planar motion of the substrate holder.Type: ApplicationFiled: October 14, 2020Publication date: October 28, 2021Inventors: Matthew Gwinn, Paul Consoli, Jerry Negrotti
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Publication number: 20130082189Abstract: A pre-aligned multi-output nozzle/skimmer (PMNS) module includes a pre-aligned nozzle assembly having at least two nozzles and a pre-aligned skimmer subassembly. The PMNS module can be pre-aligned to more accurately position a Multi-Beam Gas Cluster Ion Beam (MBGCIB), and to more accurately control the formation of the multi-beam gas clusters of a pre-aligned MBGCIB.Type: ApplicationFiled: September 30, 2011Publication date: April 4, 2013Applicant: TEL EPION INC.Inventors: Robert K. Becker, Avrum Freytsis, Matthew Gwinn
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Publication number: 20070262267Abstract: A method and apparatus 300 for better controlling scanning of a workpiece 330 through an ion beam path 306 provide for mounting a workpiece 330 on an elongated member, partially repetitively rotating the elongated member 500 around a point of rotation 368 to make repetitive scans of the workpiece 330 along and arcuate path 504 and bending the elongated member 500 at a joint 322 to move the one and out of the ion beam path 306 to facilitate attachment and removal of individual workpieces 330. A motor 315 used for the rotating may be suspended within a partial vacuum enclosure 304 against gravity for raising and lowering the elongated member and 500 a workpiece 306 for linear vertical scanning.Type: ApplicationFiled: November 30, 2006Publication date: November 15, 2007Applicant: Epion CorporationInventors: Avrum Freytsis, Matthew Gwinn, Eric Harrington
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Publication number: 20050205802Abstract: Apparatus and methods for improving processing of workpieces with gas-cluster ion beams and modifying the gas-cluster ion energy distribution in the GCIB. In a reduced-pressure environment, generating an energetic gas-cluster ion beam and subjecting the beam to increased pressure region.Type: ApplicationFiled: March 18, 2005Publication date: September 22, 2005Applicant: Epion CorporationInventors: David Swenson, John Hautala, Michael Mack, Martin Tabat, Matthew Gwinn
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Publication number: 20050205801Abstract: Apparatus and methods for improving beam stability in high current gas-cluster ion beam systems by reducing the frequency of transients occurring in the vicinity of the ionizer through use of shielding conductors and distinct component electrical biasing to inhibit backward extraction of ions from the ionizer towards the gas-jet generator.Type: ApplicationFiled: March 17, 2005Publication date: September 22, 2005Applicant: Epion CorporationInventors: Michael Mack, Robert Becker, Matthew Gwinn