Abstract: Systems for electroplating seal inspection may include a module configured to support a seal for inspection. The module may include a set of supports positioned to contact an interior rim of the seal. The module may be configured to rotate the seal about a central axis. The system may also include a detector positioned on the module. The detector may be positioned to scan an exterior surface of the seal.

Abstract: A meter electronics (20) configured to notify of an event and apportion process data is provided. The meter electronics (20) comprises a memory (230) configured to continuously store the process data (410) for a duration (412), a processor (210) communicatively coupled to the memory (230). The processor (210) is configured to detect one or more events (430) in the process data (410) and at least one of generate a notification (460) and apportion the process data (410) based on the detected one or more events (430).

Abstract: Systems for electroplating seal inspection may include a module configured to support a seal for inspection. The module may include a set of supports positioned to contact an interior rim of the seal. The module may be configured to rotate the seal about a central axis. The system may also include a detector positioned on the module. The detector may be positioned to scan an exterior surface of the seal.

Abstract: A system for transmitting electronic content over a computer network is provided. In one technique, client devices that visit a website send, to a content delivery service, interaction data that indicates that the client devices interacted with the website. Later, a content provider of the website creates a content delivery campaign with the service or establishes (or renews) a retargeting segment for an existing campaign. The content delivery campaign indicates that certain content is to be delivered to entities who have interacted with the content provider, such as by visiting the website. The content delivery service uses the interaction data to identify candidate entities who satisfy targeting criteria of the retargeting segment. If a candidate entity does satisfy the targeting criteria, then the candidate entity is added to the retargeting segment, even though the candidate entity may not have interacted with the website after the retargeting segment was created or renewed.

Abstract: A system for transmitting electronic content over a computer network is provided. In one technique, client devices that visit a website send, to a content delivery service, interaction data that indicates that the client devices interacted with the website. Later, a content provider of the website creates a content delivery campaign with the service or establishes (or renews) a retargeting segment for an existing campaign. The content delivery campaign indicates that certain content is to be delivered to entities who have interacted with the content provider, such as by visiting the website. The content delivery service uses the interaction data to identify candidate entities who satisfy targeting criteria of the retargeting segment. If a candidate entity does satisfy the targeting criteria, then the candidate entity is added to the retargeting segment, even though the candidate entity may not have interacted with the website after the retargeting segment was created or renewed.

Abstract: Methods and systems for enhancing functionality of a browser application are discloses. In an embodiment, a method enhances browser functionality using a browser add-on which enables the browser application to render web pages and other mark-up language documents or browser-rendered documents, images, audio or multimedia files that are at least in part incompatible with the current generation of browser. The add-on uses the rendering engine of prior versions of the browser and overlays their rendered image of the current generation of browser. In this way, enterprises do not have to update or upgrade web-based applications and websites do not have to necessarily upgrade the website to meet or be compatible with the current generation of browsers. In another embodiment, an enhanced browser module renders requested resources based on a DOCTYPE, inherent and/or derived properties, or metadata present within a document or related to the resource's location or its delivery stream.

Abstract: Methods and systems for redirecting browser navigation are disclosed. A method controls navigation by monitoring and intercepting requests to navigate to content from a browser. The method evaluates the requested content against rules to determine if the content is to be displayed in a specified, different browser. Upon determining that the requested content matches at least one rule, the method redirects the navigation to the specified browser in accordance with the matching rule(s). The method displays the content in the specified browser. A system for controlling navigation to content requested in a browser application includes an administrative user interface (UI) for creating and managing navigation rules. The system also comprises a browser controller for monitoring content requests in a browser, a rules engine for comparing the requested content to the rules and a controller engine for redirecting the navigation to a browser specified in applicable rules using a browser controller.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.