Patents by Inventor Matthew J. Farinelli
Matthew J. Farinelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8832936Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: GrantFiled: July 31, 2009Date of Patent: September 16, 2014Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Patent number: 8745850Abstract: An apparatus and method for manufacturing a superconducting low-pass filter for quantum computing devices. The apparatus includes a plurality of containers and input and output ports connected to opposite ends of the apparatus. A plurality of coils of superconducting wire are wound using a mandrel. An adhesive is applied to the coils for maintaining a wound state. Each of the coils are positioned in each of the containers and electrically connected to each other with at least one coil being connected to the input port and at least one coil being connected to the output port. The coils are released or expanded from their wound state using an adhesive solvent. The containers are then filled with a conductive polymer and the containers are closed with one or more covers.Type: GrantFiled: December 18, 2009Date of Patent: June 10, 2014Assignee: International Business Machines CorporationInventors: Matthew J. Farinelli, George A. Keefe, Frank Milliken, Jr., James R. Rozen
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Patent number: 8551816Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: GrantFiled: April 4, 2012Date of Patent: October 8, 2013Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
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Patent number: 8524596Abstract: Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.Type: GrantFiled: July 16, 2012Date of Patent: September 3, 2013Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight, William J. Murphy
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Publication number: 20120279767Abstract: Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.Type: ApplicationFiled: July 16, 2012Publication date: November 8, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight, William J. Murphy
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Patent number: 8294138Abstract: A method for determining whether a quantum system comprising a superconducting qubit is occupying a first basis state or a second basis state once a measurement is performed is provided. The method, comprising: applying a signal having a frequency through a transmission line coupled to the superconducting qubit characterized by two distinct, separate, and stable states of differing resonance frequencies each corresponding to the occupation of the first or second basis state prior to measurement; and measuring at least one of an output power or phase at an output port of the transmission line, wherein the measured output power or phase is indicative of whether the superconducting qubit is occupying the first basis state or the second basis state.Type: GrantFiled: February 14, 2011Date of Patent: October 23, 2012Assignee: International Business Machines CorporationInventors: Matthew J. Farinelli, George A. Keefe, Shwetank Kumar, Matthias Steffen
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Patent number: 8237271Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: GrantFiled: June 19, 2007Date of Patent: August 7, 2012Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
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Publication number: 20120187577Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: ApplicationFiled: April 4, 2012Publication date: July 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
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Patent number: 8187923Abstract: A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.Type: GrantFiled: July 3, 2008Date of Patent: May 29, 2012Assignee: International Business Machines CorporationInventors: Paul Stephen Andry, Leena Paivikki Buchwalter, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis
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Publication number: 20120091585Abstract: A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.Type: ApplicationFiled: December 6, 2011Publication date: April 19, 2012Applicant: International Business Machines CorporationInventors: Leena P. Buchwalter, Paul S. Andry, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis
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Patent number: 8159248Abstract: Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 ?m.Type: GrantFiled: August 18, 2009Date of Patent: April 17, 2012Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma
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Patent number: 8081280Abstract: In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.Type: GrantFiled: April 30, 2007Date of Patent: December 20, 2011Assignee: International Business Machines CorporationInventors: George Liang-Tai Chiu, Steven Alan Cordes, James Patrick Doyle, Matthew J. Farinelli, Minhua Lu, Hiroki Nakano, Ronald Nunes, James Vichiconti
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Patent number: 8054095Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.Type: GrantFiled: September 30, 2005Date of Patent: November 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Publication number: 20110175062Abstract: A method for determining whether a quantum system comprising a superconducting qubit is occupying a first basis state or a second basis state once a measurement is performed is provided. The method, comprising: applying a signal having a frequency through a transmission line coupled to the superconducting qubit characterized by two distinct, separate, and stable states of differing resonance frequencies each corresponding to the occupation of the first or second basis state prior to measurement; and measuring at least one of an output power or phase at an output port of the transmission line, wherein the measured output power or phase is indicative of whether the superconducting qubit is occupying the first basis state or the second basis state.Type: ApplicationFiled: February 14, 2011Publication date: July 21, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Matthew J. Farinelli, George A. Keefe, Shwetank Kumar, Matthias Steffen
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Patent number: 7932514Abstract: A method for determining whether a quantum system comprising a superconducting qubit is occupying a first basis state or a second basis state once a measurement is performed is provided. The method, comprising: applying a signal having a frequency through a transmission line coupled to the superconducting qubit characterized by two distinct, separate, and stable states of differing resonance frequencies each corresponding to the occupation of the first or second basis state prior to measurement; and measuring at least one of an output power or phase at an output port of the transmission line, wherein the measured output power or phase is indicative of whether the superconducting qubit is occupying the first basis state or the second basis state.Type: GrantFiled: May 23, 2008Date of Patent: April 26, 2011Assignee: International Business Machines CorporationInventors: Matthew J. Farinelli, George A. Keefe, Shwetank Kumar, Matthias Steffen
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Patent number: 7771208Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: GrantFiled: May 27, 2008Date of Patent: August 10, 2010Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
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Patent number: 7688095Abstract: Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 ?m.Type: GrantFiled: April 27, 2007Date of Patent: March 30, 2010Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma
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Publication number: 20100038126Abstract: Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 ?m.Type: ApplicationFiled: August 18, 2009Publication date: February 18, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma
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Publication number: 20090311849Abstract: Improved methods of separating integrated circuit chips fabricated on a single wafer are provided. In an embodiment, a method of separating integrated circuit chips fabricated on a wafer comprises: attaching a support to a back surface of the wafer; dicing the wafer to form individual integrated circuit chips attached to the support; attaching a carrier comprising a releasable adhesive material to a front surface of the wafer opposite from the back surface; separating the support from the back surface of the wafer; subjecting the carrier to an effective amount of heat, radiation, or both to reduce the adhesiveness of the adhesive material to allow for removal of at least one of the integrated circuit chips from the carrier; and picking up and moving at least one of the integrated circuit chips using a tool configured to handle the integrated circuit chips.Type: ApplicationFiled: June 17, 2008Publication date: December 17, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul S. Andry, Bing Dang, Matthew J. Farinelli, Cornelia K. Tsang
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Publication number: 20090300914Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: ApplicationFiled: July 31, 2009Publication date: December 10, 2009Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan